Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-13-320-41-001000

123-13-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3,728 -
123-13-320-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-172-16-001101

510-87-172-16-001101

CONN SOCKET PGA 172POS GOLD

Preci-Dip

3,861 -
510-87-172-16-001101

Datenblatt

Bulk 510 Active PGA 172 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-314-T-P

APA-314-T-P

ADAPTER PLUG

Samtec Inc.

2,121 -
Tube APA Active - 14 (2 x 7) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICA-318-SGG

ICA-318-SGG

CONN IC DIP SOCKET 18POS GOLD

Samtec Inc.

3,023 -
ICA-318-SGG

Datenblatt

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled
614-43-632-31-012000

614-43-632-31-012000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2,751 -
614-43-632-31-012000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-648-41-007101

116-87-648-41-007101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,687 -
116-87-648-41-007101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
28-6518-11

28-6518-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,182 -
28-6518-11

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-11

28-3518-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,850 -
28-3518-11

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-43-316-10-001000

299-43-316-10-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3,702 -
299-43-316-10-001000

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-109-12-051101

510-83-109-12-051101

CONN SOCKET PGA 109POS GOLD

Preci-Dip

2,962 -
510-83-109-12-051101

Datenblatt

Bulk 510 Active PGA 109 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-3513-11H

12-3513-11H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,702 -
12-3513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
21-0518-00

21-0518-00

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,623 -
21-0518-00

Datenblatt

Bulk 518 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-1518-11

30-1518-11

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,012 -
30-1518-11

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
44-1518-10

44-1518-10

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

2,191 -
44-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-0518-11

30-0518-11

CONN SOCKET SIP 30POS GOLD

Aries Electronics

3,919 -
30-0518-11

Datenblatt

Bulk 518 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
37-0518-10H

37-0518-10H

CONN SOCKET SIP 37POS GOLD

Aries Electronics

3,023 -
37-0518-10H

Datenblatt

Bulk 518 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-174-17-061101

510-87-174-17-061101

CONN SOCKET PGA 174POS GOLD

Preci-Dip

3,356 -
510-87-174-17-061101

Datenblatt

Bulk 510 Active PGA 174 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-174-17-081101

510-87-174-17-081101

CONN SOCKET PGA 174POS GOLD

Preci-Dip

3,713 -
510-87-174-17-081101

Datenblatt

Bulk 510 Active PGA 174 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-128-41-013000

346-93-128-41-013000

CONN SOCKET SIP 28POS GOLD

Mill-Max Manufacturing Corp.

2,497 -
346-93-128-41-013000

Datenblatt

Bulk 346 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-128-41-013000

346-43-128-41-013000

CONN SOCKET SIP 28POS GOLD

Mill-Max Manufacturing Corp.

3,345 -
346-43-128-41-013000

Datenblatt

Bulk 346 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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