Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-87-432-41-117101

114-87-432-41-117101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,611 -
114-87-432-41-117101

Datenblatt

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-008101

116-87-316-41-008101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,239 -
116-87-316-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-003101

116-87-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,363 -
116-87-322-41-003101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-322-41-003101

115-83-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,096 -
115-83-322-41-003101

Datenblatt

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-422-41-003101

115-83-422-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,393 -
115-83-422-41-003101

Datenblatt

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-006101

116-87-624-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,677 -
116-87-624-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-006101

116-87-324-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,207 -
116-87-324-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-2513-10

06-2513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,001 -
06-2513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6513-10T

06-6513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,386 -
06-6513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0518-10T

10-0518-10T

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2,925 -
10-0518-10T

Datenblatt

Bulk 518 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-1518-10T

10-1518-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,470 -
10-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-10

11-0518-10

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,572 -
11-0518-10

Datenblatt

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0517-90C

03-0517-90C

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,452 -
03-0517-90C

Datenblatt

Bulk 0517 Active SIP 3 (1 x 3) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-318-41-006101

116-83-318-41-006101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,543 -
116-83-318-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-420-41-001101

612-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,361 -
612-87-420-41-001101

Datenblatt

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-001101

116-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,175 -
116-87-314-41-001101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 32-HZL/07-TT

AR 32-HZL/07-TT

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components

2,793 -
AR 32-HZL/07-TT

Datenblatt

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
08-3513-10

08-3513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,439 -
08-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0513-10

08-0513-10

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3,817 -
08-0513-10

Datenblatt

Bulk 0513 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-210-41-011101

116-87-210-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,769 -
116-87-210-41-011101

Datenblatt

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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