Foto | Herst. Teil # | Verfügbarkeit | Preis | Menge | Datenblatt | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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BU320ZCONN IC DIP SOCKET 32POS |
3,191 | - |
|
- | BU | Active | - | 32 (2 x 16) | - | - | - | - | - | - | - | - | - | - | - | - | |
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510-87-049-07-000101CONN SOCKET PGA 49POS GOLD |
2,145 | - |
|
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Bulk | 510 | Active | PGA | 49 (7 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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114-87-628-41-134191CONN IC DIP SOCKET 28POS GOLD |
3,149 | - |
|
Bulk | 114 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
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116-83-316-41-003101CONN IC DIP SOCKET 16POS GOLD |
3,310 | - |
|
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Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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117-87-620-41-105101CONN IC DIP SOCKET 20POS GOLD |
3,105 | - |
|
![]() Datenblatt |
Bulk | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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614-87-322-31-012101CONN IC DIP SOCKET 22POS GOLD |
3,593 | - |
|
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Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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614-87-422-31-012101CONN IC DIP SOCKET 22POS GOLD |
2,652 | - |
|
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Bulk | 614 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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410-83-220-10-001101CONN ZIG-ZAG 20POS GOLD |
2,482 | - |
|
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Bulk | 410 | Active | Zig-Zag, Left Stackable | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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410-83-220-10-002101CONN ZIG-ZAG 20POS GOLD |
2,453 | - |
|
![]() Datenblatt |
Bulk | 410 | Active | Zig-Zag, Right Stackable | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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SMPX-52LCC-NSMT PLCC SOCKET 52P NON POLARISE |
2,818 | - |
|
![]() Datenblatt |
Tube | SMPX | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
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SMPX-52LCC-PSMT PLCC SOCKET 52P POLARISED RO |
2,731 | - |
|
![]() Datenblatt |
Tube | SMPX | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
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122-87-318-41-001101CONN IC DIP SOCKET 18POS GOLD |
3,203 | - |
|
![]() Datenblatt |
Bulk | 122 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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123-87-318-41-001101CONN IC DIP SOCKET 18POS GOLD |
3,819 | - |
|
![]() Datenblatt |
Bulk | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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110-87-312-41-105191CONN IC DIP SOCKET 12POS GOLD |
3,488 | - |
|
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
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510-87-044-12-071101CONN SOCKET PGA 44POS GOLD |
3,983 | - |
|
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Bulk | 510 | Active | PGA | 44 (12 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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110-83-324-41-005101CONN IC DIP SOCKET 24POS GOLD |
3,449 | - |
|
![]() Datenblatt |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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110-83-324-41-605101CONN IC DIP SOCKET 24POS GOLD |
3,297 | - |
|
![]() Datenblatt |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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110-83-424-41-005101CONN IC DIP SOCKET 24POS GOLD |
2,139 | - |
|
![]() Datenblatt |
Bulk | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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114-87-632-41-117101CONN IC DIP SOCKET 32POS GOLD |
2,805 | - |
|
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Tube | 114 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-87-632-41-134161CONN IC DIP SOCKET 32POS GOLD |
3,605 | - |
|
![]() Datenblatt |
Tube | 114 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |