RFI und EMI – Kontakte, Fingerstock und Dichtungen

制造商 Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod










































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
4268AB51K00300

4268AB51K00300

GK NICU NRS PU V0 REC

Laird Technologies EMI

2,160 -
4268AB51K00300

Datenblatt

Bulk 51K Active Fabric Over Foam Rectangle 0.161 (4.10mm) 3.000 (76.20mm) 0.071 (1.80mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
4358AB51K00200

4358AB51K00200

GK NICU NRS PU V0 DSH

Laird Technologies EMI

3,610 -
4358AB51K00200

Datenblatt

Bulk 51K Active Fabric Over Foam D-Shape 0.098 (2.50mm) 2.000 (50.80mm) 0.059 (1.50mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
0097096517

0097096517

RC,SNB,CLO .025X1.785X.430

Laird Technologies EMI

3,569 -
Bulk - Active Fingerstock - 0.510 (12.95mm) 15.000 (381.00mm) 0.140 (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip
0097048917

0097048917

BATCON,SNB .310X.740X.150

Laird Technologies EMI

3,017 -
Bulk - Active Fingerstock - - - - - Tin 299.21µin (7.60µm) -
0077004017

0077004017

SLMT,2F,SNB .110X.280X.187X.356I

Laird Technologies EMI

2,377 -
Bulk 77 Active Fingerstock - 0.787 (20.00mm) 0.356 (9.04mm) 0.110 (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0097097319

0097097319

CGCLIP,NIB,CLO .049X.080X.375

Laird Technologies EMI

2,836 -
Bulk - Active Fingerstock - - - - - Nickel 299.21µin (7.60µm) -
0097096417

0097096417

RC,PCS,SNB,CLO .025X1.723X.320IN

Laird Technologies EMI

3,047 -
Bulk - Active Fingerstock - 0.380 (9.65mm) 15.000 (381.00mm) 0.110 (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
67BSG2004507012R0B

67BSG2004507012R0B

SP,CON,S,AU,TNR

Laird Technologies EMI

2,727 -
Bulk - Active - - - - - - - - -
11-S-32AF-SN-0.917

11-S-32AF-SN-0.917

0.11 X 0.32 SN 0.917--11-S-32AF-

Leader Tech Inc.

2,494 -
11-S-32AF-SN-0.917

Datenblatt

Bulk - Active Fingerstock - 0.320 (8.13mm) 0.917 (23.29mm) 0.110 (2.79mm) Beryllium Copper Tin Flash Adhesive
67BSG2506508015R00

67BSG2506508015R00

SP,CON,S,AU,TNR

Laird Technologies EMI

2,290 -
Bulk - Active - - - - - - - - -
8-19PCI-SS-3.80

8-19PCI-SS-3.80

0.067 X 0.19 SS 3.80--8-19PCI-SS

Leader Tech Inc.

3,966 -
8-19PCI-SS-3.80

Datenblatt

Bulk - Active Fingerstock - 0.190 (4.83mm) 3.800 (96.52mm) 0.070 (1.78mm) Beryllium Copper - - Adhesive
67B3G2504810010R00

67B3G2504810010R00

SP,CON,AU,TNR 10X2.5X4.8MM

Laird Technologies EMI

2,963 -
Bulk B3G Active Fingerstock - 0.098 (2.50mm) 0.189 (4.80mm) 0.394 (10.00mm) Beryllium Copper Gold - Solder
0097097317

0097097317

CGCLIP,SNB,CLO

Laird Technologies EMI

2,916 -
0097097317

Datenblatt

Bulk Card Guide Clip-On Active - - 0.120 (3.05mm) 0.360 (9.14mm) - - - - -
0097078702

0097078702

HZCONGK,BF

Laird Technologies EMI

3,689 -
0097078702

Datenblatt

Bulk IEEE 1394 Active Fingerstock - - - - Beryllium Copper - - Slot
67BSG2507012015R0B

67BSG2507012015R0B

SP,CON,S,AU,TNR

Laird Technologies EMI

3,699 -
Bulk - Active - - - - - - - - -
8863-0110-72

8863-0110-72

EMI

Laird Technologies EMI

3,428 -
Bag Electroseal™ EcE72 Active Gasket Round 0.067 (1.70mm) - - - - - -
4084PA51H00217

4084PA51H00217

GK NICU PTAFG PU V0 SQ

Laird Technologies EMI

3,751 -
4084PA51H00217

Datenblatt

Bulk 51H Active Fabric Over Foam Square 0.500 (12.70mm) 2.170 (55.12mm) 0.500 (12.70mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
19-04-22371-S6305

19-04-22371-S6305

CHO-SEAL S6305 NI/C 0.043 1'

Parker Chomerics

2,044 -
19-04-22371-S6305

Datenblatt

Spool - Active Gasket Round 0.043 (1.09mm) 12.000 (304.80mm) - Conductive Elastomer Nickel - Non-Conductive Adhesive
4202PA51G00400

4202PA51G00400

GK,NICU,NRSG,PU,V0,DSH .120X.250

Laird Technologies EMI

3,935 -
Bulk 51G Active Fabric Over Foam D-Shape 0.250 (6.35mm) 4.000 (101.60mm) 0.120 (3.05mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive
SG090150D-24

SG090150D-24

.090H X .150W X 24L--D SHAPED

Leader Tech Inc.

3,543 -
SG090150D-24

Datenblatt

Bulk - Active Fabric Over Foam D-Shape 0.150 (3.81mm) 24.000 (609.60mm) 0.090 (2.29mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
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