RFI und EMI – Kontakte, Fingerstock und Dichtungen

制造商 Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod










































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
0077004402

0077004402

GASKET BECU 8.1MMX28.04MM

Laird Technologies EMI

3,214 -
0077004402

Datenblatt

Box Slot Mount Active Fingerstock - 0.320 (8.13mm) 1.104 (28.04mm) 0.110 (2.79mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Slot
0077003702

0077003702

GASKET BECU 7.87X37.59MM

Laird Technologies EMI

3,070 -
0077003702

Datenblatt

Box Slot Mount Active Fingerstock - 0.310 (7.87mm) 1.480 (37.59mm) 0.120 (3.05mm) Beryllium Copper - - Slot
0077008802

0077008802

GASKET BECU 14.3X37.5MM

Laird Technologies EMI

3,711 -
0077008802

Datenblatt

Box Slot Mount Active Fingerstock - 0.563 (14.30mm) 1.478 (37.54mm) 0.110 (2.79mm) Beryllium Copper - - Slot
0D97098317

0D97098317

CGCLIP SNB CLO

Laird Technologies EMI

3,345 -
Bulk Card Guide Clip-On Active Fingerstock - 0.194 (4.93mm) 0.375 (9.52mm) 0.062 (1.57mm) Beryllium Copper Tin 299.99µin (7.62µm) Clip
67B5G2003003108R0B

67B5G2003003108R0B

SP,CON,5,AU,TNR

Laird Technologies EMI

3,591 -
Bulk B5G Active - - - - - - - - -
BMI-C-004-SN

BMI-C-004-SN

SP CON S SN TNR

Laird Technologies EMI

3,919 -
BMI-C-004-SN

Datenblatt

Tape & Reel (TR) BMI-C Active Shield Finger - 0.170 (4.32mm) 0.235 (5.97mm) 0.204 (5.17mm) Beryllium Copper Tin - Solder
67BXG2503504008R00

67BXG2503504008R00

SP,CON,AU

Laird Technologies EMI

2,825 -
Bulk BXG Active Fingerstock - 0.098 (2.50mm) 0.138 (3.50mm) 0.157 (4.00mm) Beryllium Copper Gold - Solder
67BCG2504002108R00

67BCG2504002108R00

SP,CON,C,AU,TNR

Laird Technologies EMI

2,366 -
Bulk - Active - - - - - - - - -
331021483040

331021483040

WE-SECF SMT EMI CONTACT FINGER

Würth Elektronik

3,356 -
331021483040

Datenblatt

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active Shield Finger - 0.118 (3.00mm) 0.189 (4.80mm) 0.157 (4.00mm) Beryllium Copper Gold - Solder
0077002017

0077002017

SLMT,2F,SNB .220X.600X.282X.532

Laird Technologies EMI

3,680 -
Bulk 77 Active Fingerstock - 0.600 (15.24mm) 0.532 (13.51mm) 0.220 (5.59mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
67B5G2003003108R00

67B5G2003003108R00

SP,CON,5,AU,TNR

Laird Technologies EMI

2,332 -
67B5G2003003108R00

Datenblatt

Tape & Reel (TR) B5G Active Shield Finger - 0.079 (2.00mm) 0.118 (3.00mm) 0.122 (3.10mm) Beryllium Copper Nickel -
67BCG2004005310R00

67BCG2004005310R00

SP,CON,C,AU,TNR

Laird Technologies EMI

2,620 -
Bulk BCG Active - - - - - - - - -
67BCG2505005410R0B

67BCG2505005410R0B

SP,CON,C,AU,TNR

Laird Technologies EMI

2,104 -
Bulk BCG Active - - - - - - - - -
67B8G3004005108R00

67B8G3004005108R00

SP,CON,8,AU,TNR

Laird Technologies EMI

2,660 -
Bulk - Active - - - - - - - - -
67BCG2504006010R00

67BCG2504006010R00

SP,CON,C,AU,TNR

Laird Technologies EMI

2,990 -
Bulk BCG Active - - - - - - - - -
67B8G2507006215R00

67B8G2507006215R00

SP,CON,8,AU,TNR

Laird Technologies EMI

2,970 -
Bulk - Active Fingerstock - 0.098 (2.50mm) 0.276 (7.00mm) 0.244 (6.20mm) Beryllium Copper Gold - Solder
0077002802

0077002802

GASKET BECU 9.4X37.47MM

Laird Technologies EMI

3,881 -
0077002802

Datenblatt

Box Slot Mount Active Fingerstock - 0.370 (9.40mm) 1.475 (37.47mm) 0.130 (3.30mm) Beryllium Copper - - Slot
0077005502

0077005502

GASKET BECU 8.1X47MM

Laird Technologies EMI

2,492 -
0077005502

Datenblatt

Box Slot Mount Active Fingerstock - 0.320 (8.13mm) 1.852 (47.04mm) 0.110 (2.79mm) Beryllium Copper - - Slot
67BCG2006006010R00

67BCG2006006010R00

SP,CN,C,AU

Laird Technologies EMI

2,818 -
Bulk BCG Active - - - - - - - - -
67BCG2005805015R00

67BCG2005805015R00

SP,CON,C,AU,TNR

Laird Technologies EMI

2,613 -
Bulk BCG Active - - - - - - - - -
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