Thermische Kühlkörper

制造商 Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
342940

342940

COPPER HEATSINK 38.5X37.6X14MM

Aavid, Thermal Division of Boyd Corporation

2,064 -
342940

Datenblatt

Tray - Active Top Mount, Skived Push Pin Rectangular, Fins 1.480 (37.59mm) 1.516 (38.50mm) - 0.551 (14.00mm) - 2.60°C/W @ 200 LFM 15.90°C/W Copper
40532

40532

BOM ASSY 4623 LF PUSHPIN HTSNK

Vicor Corporation

2,507 -
Bulk * Active - - - - - - - - - - -
DHS-B9292-04A

DHS-B9292-04A

HEATSINK ASSY INTEL LGA2011

Delta Electronics

2,343 -
DHS-B9292-04A

Datenblatt

Box - Active Board Level Bolt On Square, Fins 3.602 (91.50mm) 3.602 (91.50mm) - 1.004 (25.50mm) - - 0.24°C/W Aluminum
40141

40141

BOM, ASSEMBLY, 6123 XF PUSH PI

Vicor Corporation

2,192 -
Bulk * Active - - - - - - - - - - -
TXP050822B

TXP050822B

HEAT SINK ELECT ISO TO-5 W/HRDWR

CTS Thermal Management Products

3,934 -
Tray - Active - - - - - - - - - - -
40533

40533

BOM ASSY 6123 XF PUSHPIN HTSNK

Vicor Corporation

3,092 -
Bulk * Active - - - - - - - - - - -
40534

40534

BOM ASSY 6123 LF PUSHPIN HTSNK

Vicor Corporation

3,660 -
Bulk * Active - - - - - - - - - - -
342943

342943

COPPER HEATSINK 50X50X14MM

Aavid, Thermal Division of Boyd Corporation

3,025 -
342943

Datenblatt

Tray - Active Top Mount, Skived Push Pin Square, Fins 1.969 (50.00mm) 1.969 (50.00mm) - 0.551 (14.00mm) - 2.10°C/W @ 200 LFM 8.90°C/W Copper
FHS-A6025B02A

FHS-A6025B02A

FAN CPU COOLER 91.5X91.5MM 12VDC

Delta Electronics

2,144 -
FHS-A6025B02A

Datenblatt

Box FHS Active Board Level Bolt On Square, Fins 3.602 (91.50mm) 3.602 (91.50mm) - 2.519 (64.00mm) - - 0.18°C/W Aluminum, Copper, Plastic
7-1542004-1

7-1542004-1

HTS93-A=HS ASSY AL CLIP

TE Connectivity AMP Connectors

3,645 -
7-1542004-1

Datenblatt

Tray - Active Top Mount Clip Cylindrical - - 2.490 (63.25mm) OD 0.433 (11.00mm) - - - Aluminum
342947

342947

COPPER HEATSINK 57.9X59X11MM

Aavid, Thermal Division of Boyd Corporation

3,792 -
342947

Datenblatt

Tray - Active Top Mount, Skived Push Pin Rectangular, Fins 2.323 (59.00mm) 2.280 (57.91mm) - 0.433 (11.00mm) - 1.90°C/W @ 200 LFM 7.70°C/W Copper
FHS-K8020S00

FHS-K8020S00

FAN CPU COOLER 80X22MM 12VDC

Delta Electronics

2,027 -
FHS-K8020S00

Datenblatt

Box FHS Active Board Level Bolt On Rectangular 7.843 (199.21mm) 3.481 (88.42mm) - 1.035 (26.30mm) - - 0.37°C/W Aluminum, Copper, Plastic
KK0808-03

KK0808-03

HEAT SPREADER FOR MPSOC TE0808

Trenz Electronic GmbH

2,757 -
KK0808-03

Datenblatt

Bulk - Active Heat Spreader Bolt On Rectangular 2.992 (76.00mm) 2.047 (52.00mm) - 0.354 (9.00mm) - - - -
40519

40519

BOM ASSY 4623 DUAL HTSNK 11MM

Vicor Corporation

3,703 -
Bulk * Active - - - - - - - - - - -
ACC-HS3-SET

ACC-HS3-SET

ACC HEATSINK ME ACC-HS3

Enclustra FPGA Solutions

2,245 -
Box ACC-HS3 Active - Bolt On Rectangular 2.205 (56.00mm) 1.063 (27.00mm) - 0.571 (14.50mm) - - - -
1542009-2

1542009-2

HEAT SINK ASSY 29MM

TE Connectivity AMP Connectors

200 -
1542009-2

Datenblatt

Tray,Box - Active Top Mount Clip Cylindrical - - 1.250 (31.75mm) OD 0.600 (15.24mm) - 5.49°C/W @ 200 LFM 12.20°C/W Aluminum
3-1542006-3

3-1542006-3

V-2461 = 47.5MM HS ASSY ALUM C

TE Connectivity AMP Connectors

2,118 -
Bulk - Active - - - - - - - - - - -
342948

342948

COPPER HEATSINK 70X69X14MM

Aavid, Thermal Division of Boyd Corporation

3,852 -
342948

Datenblatt

Tray - Active Top Mount, Skived Push Pin Square, Fins 2.717 (69.00mm) 2.756 (70.00mm) - 0.551 (14.00mm) - 1.40°C/W @ 200 LFM 5.60°C/W Copper
435AAAA

435AAAA

HEAT SINK, B4547AAAA REV

Wakefield-Vette

2,908 -
- - Active - - - - - - - - - - -
125380

125380

5WX36 EXTRUSION 16414 XX7332

Wakefield-Vette

2,983 -
125380

Datenblatt

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 36.000 (914.40mm) 5.000 (127.00mm) - 1.500 (38.10mm) - - 0.63°C/W Aluminum
Total 113324 Record«Prev1... 56085609561056115612561356145615...5667Next»
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