Thermische Kühlkörper

制造商 Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
6225B-MTG

6225B-MTG

HEATSINK TO-220 TAB BLACK

Aavid, Thermal Division of Boyd Corporation

5,774 -
6225B-MTG

Datenblatt

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.070 (27.18mm) 1.024 (26.00mm) - 0.315 (8.00mm) 2.0W @ 40°C 3.00°C/W @ 700 LFM 15.00°C/W Aluminum
501503B00000G

501503B00000G

HEATSINK TO-3 1.00 BLK

Aavid, Thermal Division of Boyd Corporation

1,651 -
501503B00000G

Datenblatt

Bag - Active Board Level Bolt On Rhombus 1.880 (47.75mm) 1.400 (35.56mm) - 1.000 (25.40mm) 5.0W @ 40°C 2.00°C/W @ 500 LFM 8.40°C/W Aluminum
ATS-PCBT1089

ATS-PCBT1089

HEATSINK TO-3 BLACK

Advanced Thermal Solutions Inc.

825 -
ATS-PCBT1089

Datenblatt

Bulk - Active Board Level Bolt On Square, Fins 2.520 (64.00mm) 2.520 (64.00mm) - 0.917 (23.30mm) - 2.60°C/W @ 200 LFM 6.00°C/W Aluminum
OMNI-UNI-30-25-D

OMNI-UNI-30-25-D

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette

160 -
OMNI-UNI-30-25-D

Datenblatt

Bulk OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 0.984 (25.00mm) 1.181 (30.00mm) - 2.362 (60.00mm) - - - Aluminum
D10850-40

D10850-40

HEATSINK 128PQFP COMPOSITE

Wakefield-Vette

213 -
D10850-40

Datenblatt

Bulk Deltem™ Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.850 (21.59mm) 0.850 (21.59mm) - 0.400 (10.16mm) 2.5W @ 90°C 20.00°C/W @ 100 LFM - Composite
531202B02100G

531202B02100G

HEATSINK TO-220 SOLDERPIN 50.8MM

Aavid, Thermal Division of Boyd Corporation

2,436 -
531202B02100G

Datenblatt

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.000 (50.80mm) 1.375 (34.93mm) - 0.500 (12.70mm) 8.0W @ 60°C 4.00°C/W @ 600 LFM 7.50°C/W Aluminum
OMNI-UNI-PF-38

OMNI-UNI-PF-38

TO-247 TO-264 TO-220 HEATSINK

Wakefield-Vette

306 -
OMNI-UNI-PF-38

Datenblatt

Bulk OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 1.500 (38.10mm) 1.180 (29.97mm) - 0.690 (17.53mm) - - 8.07°C/W Aluminum
501403B00000G

501403B00000G

HEAT SINK TO-3 .750 COMPACT

Aavid, Thermal Division of Boyd Corporation

1,572 -
501403B00000G

Datenblatt

Bag - Active Board Level Bolt On Rhombus 1.880 (47.75mm) 1.400 (35.56mm) - 0.750 (19.05mm) 4.0W @ 40°C 3.00°C/W @ 400 LFM 10.00°C/W Aluminum
ATS-CPX050050012-201-C3-R0

ATS-CPX050050012-201-C3-R0

HEATSINK 50X50X12MM XCUT CP

Advanced Thermal Solutions Inc.

293 -
ATS-CPX050050012-201-C3-R0

Datenblatt

Tray pushPIN™ Active Top Mount Push Pin Square, Fins 1.969 (50.00mm) 1.969 (50.00mm) - 0.472 (12.00mm) - 8.29°C/W @ 100 LFM - Aluminum
C264-030-1VE

C264-030-1VE

HEATSINK AND CLIP FOR TO-264

Ohmite

200 -
C264-030-1VE

Datenblatt

Box C Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.181 (30.00mm) 1.500 (38.10mm) - 0.710 (18.03mm) - - - Aluminum
374924B00032G

374924B00032G

HEATSINK BGA W/ADHESIVE TAPE

Aavid, Thermal Division of Boyd Corporation

1,809 -
374924B00032G

Datenblatt

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.575 (40.00mm) 1.575 (40.01mm) - 0.394 (10.00mm) 4.0W @ 80°C 6.50°C/W @ 200 LFM 20.30°C/W Aluminum
ATS-CPX040040035-158-C1-R0

ATS-CPX040040035-158-C1-R0

HEATSINK 40X40X35MM L-TAB CP

Advanced Thermal Solutions Inc.

107 -
ATS-CPX040040035-158-C1-R0

Datenblatt

Tray pushPIN™ Active Top Mount Push Pin Square, Fins 1.575 (40.00mm) 1.575 (40.00mm) - 1.378 (35.00mm) - 2.77°C/W @ 100 LFM - Aluminum
ATS-FPX035035035-60-C1-R0

ATS-FPX035035035-60-C1-R0

HEATSINK 35X35X35MM L-TAB FP

Advanced Thermal Solutions Inc.

101 -
ATS-FPX035035035-60-C1-R0

Datenblatt

Tray pushPIN™ Active Top Mount Push Pin Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 1.378 (35.00mm) - 6.33°C/W @ 100 LFM - Aluminum
PV-T2X-38E

PV-T2X-38E

PIN FIN HEATSINK

Ohmite

223 -
PV-T2X-38E

Datenblatt

Box P Active Board Level, Vertical Clip and PC Pin Rectangular, Pin Fins 1.180 (29.97mm) 0.690 (17.53mm) - 1.500 (38.10mm) - - 8.07°C/W Aluminum
OMNI-UNI-40-25-D

OMNI-UNI-40-25-D

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette

280 -
OMNI-UNI-40-25-D

Datenblatt

Bulk OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 0.984 (25.00mm) 1.575 (40.00mm) - 2.953 (75.00mm) - - - Aluminum
WAVE-35-21

WAVE-35-21

ANCHOR HEATSINK 35X35X21MM

Wakefield-Vette

829 -
WAVE-35-21

Datenblatt

Bulk Wave 3x Active Board Level Clip Square, Angled Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.827 (21.00mm) - 2.11°C/W @ 200 LFM - Aluminum Alloy
ATS-FPX030030030-83-C2-R0

ATS-FPX030030030-83-C2-R0

HEATSINK 30X30X30MM R-TAB FP

Advanced Thermal Solutions Inc.

465 -
ATS-FPX030030030-83-C2-R0

Datenblatt

Bulk pushPIN™ Active Top Mount Push Pin Square, Fins 1.181 (30.00mm) 1.181 (30.00mm) - 1.181 (30.00mm) - 8.57°C/W @ 100 LFM - Aluminum
960-21-12-S-AB-0

960-21-12-S-AB-0

HEATSINK 21X12MM SIDE PUSH PIN

Wakefield-Vette

444 -
960-21-12-S-AB-0

Datenblatt

Box 960 Active Top Mount Push Pin Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.472 (12.00mm) - 7.90°C/W @ 200 LFM - Aluminum
ATS-FPX030030030-53-C2-R0

ATS-FPX030030030-53-C2-R0

HEATSINK 30X30X30MM L-TAB FP

Advanced Thermal Solutions Inc.

199 -
ATS-FPX030030030-53-C2-R0

Datenblatt

Bulk pushPIN™ Active Top Mount Push Pin Square, Fins 1.181 (30.00mm) 1.181 (30.00mm) - 1.181 (30.00mm) - 8.57°C/W @ 100 LFM - Aluminum
CR301-50AE

CR301-50AE

ALUMINUM HEATSINK 50MM BLK ANODI

Ohmite

133 -
CR301-50AE

Datenblatt

Box CR Active Board Level, Vertical 2 Clips and PC Pin Rectangular, Fins 1.969 (50.00mm) 2.362 (60.00mm) - - - - 5.70°C/W Aluminum Alloy
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