Thermische Kühlkörper

制造商 Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
HSE01-193175

HSE01-193175

HEAT SINK, EXTRUSION, 19 X 31.5

CUI Devices

1,580 -
HSE01-193175

Datasheet

Box HSE Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Angled Fins 0.748 (19.00mm) 0.748 (19.00mm) - 0.295 (7.50mm) 2.95W @ 75°C 9.20°C/W @ 200 LFM 25.44°C/W Aluminum Alloy
HSS07-C20-P274

HSS07-C20-P274

HEAT SINK, STAMPING, TO-220, 21.

CUI Devices

1,890 -
HSS07-C20-P274

Datasheet

Box HSS Active Board Level, Vertical PC Pin Rectangular 0.853 (21.66mm) 0.520 (13.21mm) - 0.515 (13.08mm) 2.5W @ 75°C 12.60°C/W @ 200 LFM 29.57°C/W Copper Alloy
HSB23-232325

HSB23-232325

HEAT SINK, BGA, 23 X 23 X 25 MM

CUI Devices

1,202 -
HSB23-232325

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.906 (23.00mm) 0.906 (23.00mm) - 0.984 (25.00mm) 6.13W @ 75°C 3.80°C/W @ 200 LFM 12.23°C/W Aluminum Alloy
HSE05-171933

HSE05-171933

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

3,230 -
HSE05-171933

Datasheet

Box HSE Active Board Level PC Pin Rectangular, Angled Fins 0.764 (19.40mm) 0.669 (17.00mm) - 1.280 (32.50mm) 3.98W @ 75°C 6.90°C/W @ 200 LFM 18.83°C/W Aluminum Alloy
HSE02-173213

HSE02-173213

HEAT SINK, EXTRUSION, 17 X 31.9

CUI Devices

1,542 -
HSE02-173213

Datasheet

Box HSE Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Angled Fins 0.669 (17.00mm) 0.669 (17.00mm) - 0.492 (12.50mm) 3.5W @ 75°C 6.70°C/W @ 200 LFM 21.44°C/W Aluminum Alloy
HSE01-193175P

HSE01-193175P

HEAT SINK, EXTRUSION, 19 X 31.5

CUI Devices

1,584 -
HSE01-193175P

Datasheet

Box HSE Active Top Mount Thermal Tape, Adhesive (Included) Square, Angled Fins 0.748 (19.00mm) 0.748 (19.00mm) - 0.295 (7.50mm) 2.95W @ 75°C 9.20°C/W @ 200 LFM 25.44°C/W Aluminum Alloy
HSB30-373710

HSB30-373710

HEAT SINK, BGA, 37.4 X 37 X 10 M

CUI Devices

665 -
HSB30-373710

Datasheet

Box HSB Active - - - - - - - - - - -
HSE06-503045

HSE06-503045

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

1,197 -
HSE06-503045

Datasheet

Bag HSE Active Board Level Clip Rectangular, Fins 1.969 (50.00mm) 1.181 (30.00mm) - 1.772 (45.00mm) 12.79W @ 75°C 2.10°C/W @ 200 LFM 5.86°C/W Aluminum Alloy
HSE08-505028

HSE08-505028

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

1,118 -
HSE08-505028

Datasheet

Bag HSE Active Board Level Clip Rectangular, Angled Fins 1.969 (50.00mm) 1.102 (28.00mm) - 1.969 (50.00mm) 10.53W @ 75°C 2.70°C/W @ 200 LFM 7.13°C/W Aluminum Alloy
HSB27-434316

HSB27-434316

HEAT SINK, BGA, 43.1 X 43.1 X 16

CUI Devices

1,081 -
HSB27-434316

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.697 (43.10mm) 1.697 (43.10mm) - 0.650 (16.51mm) 8.98W @ 75°C 2.80°C/W @ 200 LFM 8.35°C/W Aluminum Alloy
HSE02-173213P

HSE02-173213P

HEAT SINK, EXTRUSION, 17 X 31.9

CUI Devices

1,572 -
HSE02-173213P

Datasheet

Box HSE Active Top Mount Thermal Tape, Adhesive (Included) Square, Angled Fins 0.669 (17.00mm) 0.669 (17.00mm) - 0.492 (12.50mm) 3.5W @ 75°C 6.70°C/W @ 200 LFM 21.44°C/W Aluminum Alloy
HSE07-753045

HSE07-753045

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

993 -
HSE07-753045

Datasheet

Bag HSE Active Board Level Clip Rectangular, Fins 2.953 (75.00mm) 1.181 (30.00mm) - 1.772 (45.00mm) 15.46W @ 75°C 2.10°C/W @ 200 LFM 4.85°C/W Aluminum Alloy
HSE09-755028

HSE09-755028

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

999 -
HSE09-755028

Datasheet

Bag HSE Active Board Level Clip Rectangular, Angled Fins 2.953 (75.00mm) 1.102 (28.00mm) - 1.969 (50.00mm) 13.26W @ 75°C 2.50°C/W @ 200 LFM 5.66°C/W Aluminum Alloy
HSS-B20-CP-01

HSS-B20-CP-01

HEATSINK TO-220 2.6W ALUMINUM

CUI Devices

545 -
HSS-B20-CP-01

Datasheet

Box HSS Active Board Level Clip Rectangular, Fins 0.375 (9.53mm) 0.900 (22.86mm) - 0.740 (18.79mm) 2.6W @ 75°C 6.32°C/W @ 200 LFM 28.85°C/W Aluminum
HSE-B20250-040H-01

HSE-B20250-040H-01

HEAT SINK, EXTRUSION, TO-220, 25

CUI Devices

616 -
HSE-B20250-040H-01

Datasheet

Box HSE Active Board Level, Vertical PC Pin Rectangular, Angled Fins 0.984 (25.00mm) 1.359 (34.50mm) - 0.492 (12.50mm) 5.5W @ 75°C 4.44°C/W @ 200 LFM 13.64°C/W Aluminum Alloy
HSB06-181810

HSB06-181810

HEAT SINK, BGA, 18 X 18 X 10 MM

CUI Devices

780 -
HSB06-181810

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.709 (18.00mm) 0.709 (18.00mm) - 0.394 (10.00mm) 3.2W @ 75°C 18.80°C/W @ 200 LFM 23.68°C/W Aluminum Alloy
HSS13-B20-NP

HSS13-B20-NP

HEAT SINK, STAMPING, TO-220, 31

CUI Devices

646 -
HSS13-B20-NP

Datasheet

Box HSS Active Board Level, Vertical - Rectangular 1.220 (31.00mm) 0.994 (25.25mm) - 0.508 (12.90mm) 4.8W @ 75°C 7.70°C/W @ 200 LFM 15.50°C/W Aluminum Alloy
HSB19-272718

HSB19-272718

HEAT SINK, BGA, 27 X 27 X 18 MM

CUI Devices

239 -
HSB19-272718

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.709 (18.00mm) 6.8W @ 75°C 4.50°C/W @ 200 LFM 11.11°C/W Aluminum Alloy
HSS-B20-NPR-02

HSS-B20-NPR-02

HEATSINK TO-220 5.1W ALUMINUM

CUI Devices

712 -
HSS-B20-NPR-02

Datasheet

Bag HSS Active Board Level, Vertical Bolt On and Board Mounts Rectangular, Fins 0.500 (12.70mm) 1.000 (25.40mm) - 1.180 (29.97mm) 5.1W @ 75°C 4.20°C/W @ 200 LFM 14.71°C/W Aluminum
HSE-B254-045H

HSE-B254-045H

HEAT SINK, EXTRUSION, TO-220, 25

CUI Devices

703 -
HSE-B254-045H

Datasheet

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 1.000 (25.40mm) 1.772 (45.00mm) - 0.500 (12.70mm) 6.4W @ 75°C 3.86°C/W @ 200 LFM 11.72°C/W Aluminum Alloy
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