Foto | Herst. Teil # | Verfügbarkeit | Preis | Menge | Datenblatt | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
70-1002-0511SOLDER PASTE WATER SOLUBLE 600GM |
2,466 | - |
|
Datenblatt |
Bulk | HydroMark 531 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | |
70-1003-0511SOLDER PASTE WATER SOLUBLE 600GM |
2,086 | - |
|
Datenblatt |
Bulk | HydroMark 531 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | |
70-2102-0511SOLDER PASTE WATER SOLUBLE 600GM |
3,032 | - |
|
Datenblatt |
Bulk | R562 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | |
70-2103-0511SOLDER PASTE WATER SOLUBLE 600GM |
2,902 | - |
|
Datenblatt |
Bulk | R562 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | |
92-7068-6407SOLDER FLUX-CORED/331.0240 500G |
3,416 | - |
|
Datenblatt |
Bulk | 331 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040 (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 18 AWG, 19 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | |
96-7068-8840SOLDER FLUX-CORED/245 .040 500G |
2,371 | - |
|
Datenblatt |
Bulk | 245 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040 (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | |
92-7068-6406SOLDER FLUX-CORED/331.0240 500G |
3,609 | - |
|
Datenblatt |
Bulk | 331 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040 (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 18 AWG, 19 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | |
92-7068-7619SOLDER FLUX-CORED/275 .025 500G |
2,930 | - |
|
Datenblatt |
Bulk | 275 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025 (0.64mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | |
92-7068-8842SOLDER FLUX-CORED/245 .062 500G |
3,823 | - |
|
Datenblatt |
Bulk | 245 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062 (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 14 AWG, 16 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | |
70-0102-0610SOLDER PASTE NO CLEAN 500GM |
2,327 | - |
|
Datenblatt |
Bulk | EP256 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | |
70-1003-0610SOLDER PASTE WATER SOLUBLE 500GM |
2,165 | - |
|
Datenblatt |
Bulk | HydroMark 531 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | |
70-1302-0510SOLDER PASTE R231 ROSIN 500GM |
3,845 | - |
|
Datenblatt |
Bulk | R231 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Rosin Mildly Activated (RMA) | - | 3 | Leaded | Jar, 17.64 oz (500g) | 4 Months | Date of Manufacture | |
70-4105-0810SOLDER PASTE NO CLEAN 500GM |
2,727 | - |
|
Datenblatt |
Bulk | NP545 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | |
92-7068-7644SOLDER FLUX-CORED/275 .025 500G |
2,103 | - |
|
Datenblatt |
Bulk | 275 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025 (0.64mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | |
92-7068-8840SOLDER FLUX-CORED/245 .0240 500 |
2,331 | - |
|
Datenblatt |
Bulk | 245 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040 (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | |
96-7068-8820SOLDER FLUX-CORED/245 .020 500G |
3,348 | - |
|
Datenblatt |
Bulk | 245 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | |
96-7068-8825SOLDER FLUX-CORED/245 .025 500G |
3,748 | - |
|
Datenblatt |
Bulk | 245 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025 (0.64mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | |
70-0605-0810SOLDER PASTE NO CLEAN 500GM |
2,695 | - |
|
Datenblatt |
Bulk | EM907 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 4 Months | Date of Manufacture | |
70-1002-0310SOLDER PASTE WATER SOLUBLE 500GM |
2,231 | - |
|
Datenblatt |
Bulk | HydroMark 531 | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | |
70-2102-0310SOLDER PASTE WATER SOLUBLE 500GM |
3,069 | - |
|
Datenblatt |
Bulk | R562 | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |