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制造商 Packaging Series ProductStatus Type Composition Diameter MeltingPoint FluxType WireGauge MeshType Process Form ShelfLife ShelfLifeStart







































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type Composition Diameter MeltingPoint FluxType WireGauge MeshType Process Form ShelfLife ShelfLifeStart
SMDLTLFP10T4

SMDLTLFP10T4

SOLDER PASTE LOW TEMP T4 10CC

Chip Quik Inc.

2,453 -
SMDLTLFP10T4

Datenblatt

Syringe - Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture
NC191LT50T5

NC191LT50T5

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

3,271 -
NC191LT50T5

Datenblatt

Bulk Smooth Flow™ Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 280°F (138°C) No-Clean - 5 Lead Free Jar, 1.76 oz (50g) 6 Months Date of Manufacture
SMD2024-25000

SMD2024-25000

SOLDER SPHERES SN96.5/AG3.0/CU0.

Chip Quik Inc.

2,992 -
SMD2024-25000

Datenblatt

Bulk SMD2 Active Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.012 (0.31mm) 423 ~ 428°F (217 ~ 220°C) - - - Lead Free Jar 24 Months Date of Manufacture
SMD291SNL10T4

SMD291SNL10T4

SLDR PST NO-CLEAN SAC305 T4 10CC

Chip Quik Inc.

3,151 -
SMD291SNL10T4

Datenblatt

Syringe - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture
SMD3SW.020 4OZ

SMD3SW.020 4OZ

SOLDER WIRE 62/36/2 TIN/LEAD/SIL

Chip Quik Inc.

3,491 -
SMD3SW.020 4OZ

Datenblatt

Bulk SMD3 Active Wire Solder Sn62Pb36Ag2 (62/36/2) 0.020 (0.51mm) 354°F (179°C) No-Clean, Water Soluble - - Leaded Spool, 4 oz (113.40g) - -
NC191SNL35T5

NC191SNL35T5

SMOOTH FLOW LEAD-FREE SOLDER PAS

Chip Quik Inc.

2,776 -
NC191SNL35T5

Datenblatt

Bulk Smooth Flow™ Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 422 ~ 428°F (217 ~ 220°C) No-Clean - 5 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture
4865-227G

4865-227G

SOLDER NO-CLEAN 63/37 1/2 LB

MG Chemicals

2,615 -
4865-227G

Datenblatt

Spool 4860 Active Wire Solder Sn63Pb37 (63/37) 0.032 (0.81mm) 361°F (183°C) No-Clean 20 AWG, 21 SWG - Leaded Spool, 8 oz (227g), 1/2 lb 60 Months -
4887-227G

4887-227G

SOLDER RA 63/37 .050 1/2 LBS

MG Chemicals

3,032 -
4887-227G

Datenblatt

Spool 4880 Active Wire Solder Sn63Pb37 (63/37) 0.050 (1.27mm) 361°F (183°C) Rosin Activated (RA) 16 AWG, 18 SWG - Leaded Spool, 8 oz (227g), 1/2 lb 60 Months -
RASW.031 1LB

RASW.031 1LB

SOLDER WIRE 63/37 TIN/LEAD ROSIN

Chip Quik Inc.

2,428 -
RASW.031 1LB

Datenblatt

Bulk - Active Wire Solder Sn63Pb37 (63/37) 0.031 (0.79mm) 361°F (183°C) Rosin Activated (RA) 21 AWG, 20 SWG - Leaded Spool, 1 lb (454 g) - -
T0051386570

T0051386570

WSW SAC M1 SN3,0AG0,5CU3,5%

Apex Tool Group

3,318 -
T0051386570

Datenblatt

Spool Weller® Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.008 (0.20mm) - No-Clean - - Lead Free Spool, 0.35 oz (10g) - -
NC191AX250

NC191AX250

SMOOTH FLOW LEADED SOLDER PASTE

Chip Quik Inc.

3,813 -
NC191AX250

Datenblatt

Bulk Smooth Flow™ Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture
4886-454G

4886-454G

SOLDER RA 63/37 1 LB

MG Chemicals

2,687 -
4886-454G

Datenblatt

Spool 4880 Active Wire Solder Sn63Pb37 (63/37) 0.040 (1.02mm) 361°F (183°C) Rosin Activated (RA) 18 AWG, 19 SWG - Leaded Spool, 1 lb (454 g) 60 Months -
RASWLF.031 8OZ

RASWLF.031 8OZ

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

Chip Quik Inc.

3,736 -
RASWLF.031 8OZ

Datenblatt

Bulk - Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031 (0.79mm) 422 ~ 428°F (217 ~ 220°C) Rosin Activated (RA) 21 AWG, 20 SWG - Lead Free Spool, 8 oz (227g), 1/2 lb - -
NC191SNL250

NC191SNL250

SMOOTH FLOW LEAD-FREE SOLDER PAS

Chip Quik Inc.

2,340 -
NC191SNL250

Datenblatt

Bulk Smooth Flow™ Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 422 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture
NC191LT250

NC191LT250

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

3,780 -
NC191LT250

Datenblatt

Bulk Smooth Flow™ Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 280°F (138°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture
RASWLF.015 8OZ

RASWLF.015 8OZ

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

Chip Quik Inc.

3,685 -
RASWLF.015 8OZ

Datenblatt

Bulk - Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.015 (0.38mm) 422 ~ 428°F (217 ~ 220°C) Rosin Activated (RA) 27 AWG, 28 SWG - Lead Free Spool, 8 oz (227g), 1/2 lb - -
NC191LT250T5

NC191LT250T5

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

3,459 -
NC191LT250T5

Datenblatt

Bulk Smooth Flow™ Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 280°F (138°C) No-Clean - 5 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture
SMD3SWLT.040 50G

SMD3SWLT.040 50G

SN42/BI58 2.2% FLUX CORE SOLDER

Chip Quik Inc.

3,401 -
SMD3SWLT.040 50G

Datenblatt

Bulk SMD3 Active Wire Solder Bi58Sn42 (58/42) 0.040 (1.02mm) 280°F (138°C) No-Clean, Rosin Activated (RA) - - Lead Free Spool, 1.8 oz (50g) - -
BARSN96.5AG3.0CU0.5

BARSN96.5AG3.0CU0.5

SOLDER BAR SN96.5/AG3.0/CU0.5 1L

Chip Quik Inc.

3,950 -
BARSN96.5AG3.0CU0.5

Datenblatt

Bulk Super Low Dross™ Active Bar Solder Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) - 422 ~ 428°F (217 ~ 220°C) - - - Lead Free Bar, 1 lb (454g) - -
NC191SNL250T5

NC191SNL250T5

SMOOTH FLOW LEAD-FREE SOLDER PAS

Chip Quik Inc.

3,957 -
NC191SNL250T5

Datenblatt

Bulk Smooth Flow™ Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 422 ~ 428°F (217 ~ 220°C) No-Clean - 5 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture
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