Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-040-11-061101

510-87-040-11-061101

CONN SOCKET PGA 40POS GOLD

Preci-Dip

3,503 -
510-87-040-11-061101

Datenblatt

Bulk 510 Active PGA 40 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-012101

116-87-316-41-012101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,684 -
116-87-316-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-008101

116-83-610-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,912 -
116-83-610-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-011101

116-87-610-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,507 -
116-87-610-41-011101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-105161

110-87-320-41-105161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,801 -
110-87-320-41-105161

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-006101

116-87-320-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,485 -
116-87-320-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-428-41-001101

115-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,018 -
Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-009101

116-83-210-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,639 -
116-83-210-41-009101

Datenblatt

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-009101

116-83-310-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,139 -
116-83-310-41-009101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-108-41-005101

917-83-108-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

3,777 -
917-83-108-41-005101

Datenblatt

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-108-41-053101

917-83-108-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

3,469 -
917-83-108-41-053101

Datenblatt

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-208-41-005101

917-83-208-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

2,015 -
917-83-208-41-005101

Datenblatt

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-208-41-053101

917-83-208-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

3,668 -
917-83-208-41-053101

Datenblatt

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-316-41-001101

614-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,293 -
614-83-316-41-001101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-003101

116-87-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2,461 -
116-87-318-41-003101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-3513-10

06-3513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,426 -
06-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-314-31-012101

614-83-314-31-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,748 -
614-83-314-31-012101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-312-41-001101

121-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2,461 -
121-83-312-41-001101

Datenblatt

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-320-41-001101

115-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,060 -
Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-002101

116-87-314-41-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,916 -
116-87-314-41-002101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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