Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
AW 127-26/Z-T

AW 127-26/Z-T

SOCKET 26 CONTACTS SINGLE ROW

Assmann WSW Components

2,258 -
AW 127-26/Z-T

Datenblatt

- - Active - - - - - - - - - - - - - -
02-0513-10T

02-0513-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,297 -
02-0513-10T

Datenblatt

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-10H

02-0518-10H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,709 -
02-0518-10H

Datenblatt

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-10T

02-0518-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,654 -
02-0518-10T

Datenblatt

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10H

02-1518-10H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,145 -
02-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10T

02-1518-10T

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,764 -
02-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
146-83-304-41-035101

146-83-304-41-035101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,382 -
146-83-304-41-035101

Datenblatt

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-304-41-036101

146-83-304-41-036101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,619 -
146-83-304-41-036101

Datenblatt

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-312-41-005101

110-87-312-41-005101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,950 -
110-87-312-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-308-41-001101

110-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,892 -
110-83-308-41-001101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-308-41-105101

110-87-308-41-105101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,610 -
110-87-308-41-105101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-308-41-001101

614-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,372 -
614-87-308-41-001101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-210-41-117101

114-87-210-41-117101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,032 -
114-87-210-41-117101

Datenblatt

Bulk 114 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-002101

116-83-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,043 -
116-83-304-41-002101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-27/Z-T

AW 127-27/Z-T

SOCKET 27 CONTACTS SINGLE ROW

Assmann WSW Components

3,119 -
AW 127-27/Z-T

Datenblatt

- - Active - - - - - - - - - - - - - -
01-0513-10H

01-0513-10H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,468 -
01-0513-10H

Datenblatt

Bulk 0513 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0513-10

02-0513-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,984 -
02-0513-10

Datenblatt

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-304-41-008101

116-83-304-41-008101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,514 -
116-83-304-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-006101

116-83-310-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,618 -
116-83-310-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-006101

116-83-610-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,547 -
116-83-610-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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