Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-43-424-41-003000

115-43-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

488 -
115-43-424-41-003000

Datasheet

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-316-41-005000

117-43-316-41-005000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

194 -
117-43-316-41-005000

Datasheet

Tube 117 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-648-41-003000

115-43-648-41-003000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3,426 -
115-43-648-41-003000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-316-11-001000

299-93-316-11-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2,416 -
299-93-316-11-001000

Datasheet

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-318-41-801000

110-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3,756 -
110-13-318-41-801000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-316-41-801000

123-43-316-41-801000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3,422 -
123-43-316-41-801000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-616-10-002000

299-43-616-10-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3,913 -
299-43-616-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-640-31-012000

614-43-640-31-012000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2,747 -
614-43-640-31-012000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-652-41-005000

117-43-652-41-005000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,022 -
117-43-652-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-624-41-801000

123-93-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,653 -
123-93-624-41-801000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-210-41-001000

111-93-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,792 -
111-93-210-41-001000

Datasheet

Tube 111 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-314-41-105000

110-93-314-41-105000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,332 -
110-93-314-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-420-41-001000

110-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

658 -
110-93-420-41-001000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-628-41-001000

115-47-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,892 -
115-47-628-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-428-41-001000

111-41-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,372 -
111-41-428-41-001000

Datasheet

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-316-41-605000

110-93-316-41-605000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3,343 -
110-93-316-41-605000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-432-41-001000

110-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3,471 -
110-93-432-41-001000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-322-41-105000

110-93-322-41-105000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3,565 -
110-93-322-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-93-628-41-005000

117-93-628-41-005000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

197 -
117-93-628-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-624-31-012000

614-43-624-31-012000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,873 -
614-43-624-31-012000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 1516171819202122...608Next»
HEIM

HEIM

PRODUKT

PRODUKT

TELEFON

TELEFON

BENUTZER

BENUTZER