Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
01-0508-20

01-0508-20

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,070 -
01-0508-20

Datasheet

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
01-0508-30

01-0508-30

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,632 -
01-0508-30

Datasheet

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
02-0513-11

02-0513-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3,072 -
02-0513-11

Datasheet

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-10H

04-0518-10H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,556 -
04-0518-10H

Datasheet

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-10H

04-1518-10H

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2,561 -
04-1518-10H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-10

05-0518-10

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2,140 -
05-0518-10

Datasheet

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0513-10T

04-0513-10T

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,000 -
04-0513-10T

Datasheet

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0503-20

01-0503-20

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,355 -
01-0503-20

Datasheet

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
01-0503-30

01-0503-30

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,774 -
01-0503-30

Datasheet

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Tin 30.0µin (0.76µm) Brass Polyamide (PA), Nylon, Glass Filled
02-0513-11H

02-0513-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,938 -
02-0513-11H

Datasheet

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0513-10

04-0513-10

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,142 -
04-0513-10

Datasheet

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-00

04-1518-00

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2,896 -
04-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-11H

02-0518-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3,053 -
02-0518-11H

Datasheet

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-11H

02-1518-11H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2,576 -
02-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-00

04-0518-00

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,359 -
04-0518-00

Datasheet

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-11

04-0518-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2,872 -
04-0518-11

Datasheet

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-11

04-1518-11

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2,282 -
04-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-10T

05-0518-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2,792 -
05-0518-10T

Datasheet

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-10H

05-0518-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2,123 -
05-0518-10H

Datasheet

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-10

06-1518-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,120 -
06-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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