Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
12-7500-10

12-7500-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

3,263 -
12-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-7550-10

12-7550-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

2,682 -
12-7550-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-7590-10

12-7590-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

3,622 -
12-7590-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-7750-10

12-7750-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

2,064 -
12-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-0508-20

22-0508-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,454 -
22-0508-20

Datasheet

Bulk 508 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
22-0508-30

22-0508-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,079 -
22-0508-30

Datasheet

Bulk 508 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
22-1508-20

22-1508-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,032 -
22-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
22-1508-30

22-1508-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,922 -
22-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
10-0501-31

10-0501-31

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2,517 -
10-0501-31

Datasheet

Bulk 501 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6810-90TWR

10-6810-90TWR

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

2,203 -
10-6810-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-9513-11H

20-9513-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,426 -
20-9513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-810-90TWR

16-810-90TWR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2,518 -
16-810-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-0503-20

18-0503-20

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2,315 -
18-0503-20

Datasheet

Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
18-0503-30

18-0503-30

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2,020 -
18-0503-30

Datasheet

Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
16-3508-201

16-3508-201

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,154 -
16-3508-201

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-301

16-3508-301

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,713 -
16-3508-301

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-822-90

14-822-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,099 -
14-822-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
03-0511-11

03-0511-11

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,495 -
03-0511-11

Datasheet

Bulk 511 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
13-0501-20

13-0501-20

CONN SOCKET SIP 13POS TIN

Aries Electronics

3,401 -
13-0501-20

Datasheet

Bulk 501 Active SIP 13 (1 x 13) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
13-0501-30

13-0501-30

CONN SOCKET SIP 13POS TIN

Aries Electronics

3,517 -
13-0501-30

Datasheet

Bulk 501 Active SIP 13 (1 x 13) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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