Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-6513-11

32-6513-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,060 -
32-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-01

14-3518-01

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,696 -
14-3518-01

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0508-20

17-0508-20

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,301 -
17-0508-20

Datasheet

Bulk 508 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
17-0508-30

17-0508-30

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,414 -
17-0508-30

Datasheet

Bulk 508 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
31-0518-00

31-0518-00

CONN SOCKET SIP 31POS GOLD

Aries Electronics

3,810 -
31-0518-00

Datasheet

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-11H

28-0518-11H

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3,483 -
28-0518-11H

Datasheet

Bulk 518 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-11H

28-1518-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,868 -
28-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-822-90E

14-822-90E

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,108 -
14-822-90E

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
32-6518-10M

32-6518-10M

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,519 -
32-6518-10M

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
21-0511-10

21-0511-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

3,687 -
21-0511-10

Datasheet

Bulk 511 Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-11H

18-3518-11H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,879 -
18-3518-11H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3503-20

16-3503-20

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,336 -
16-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3503-30

16-3503-30

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,040 -
16-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-3501-21

14-3501-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,192 -
14-3501-21

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-3501-31

14-3501-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,843 -
14-3501-31

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-0503-20

14-0503-20

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,637 -
14-0503-20

Datasheet

Bulk 0503 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
14-0503-30

14-0503-30

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,654 -
14-0503-30

Datasheet

Bulk 0503 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
06-810-90C

06-810-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,363 -
06-810-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-810-90C

08-810-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,850 -
08-810-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-11H

27-0518-11H

CONN SOCKET SIP 27POS GOLD

Aries Electronics

3,794 -
27-0518-11H

Datasheet

Bulk 518 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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