Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果: 21991
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-6513-10T

40-6513-10T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,069 -
40-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-10E

14-3518-10E

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,311 -
14-3518-10E

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0518-00

22-0518-00

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2,499 -
22-0518-00

Datasheet

Bulk 518 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-1518-00

22-1518-00

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,559 -
22-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-6511-10

30-6511-10

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

2,819 -
30-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7400-11

02-7400-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3,196 -
02-7400-11

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7425-11

02-7425-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3,523 -
02-7425-11

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-6513-10

30-6513-10

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,029 -
30-6513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-10

28-3513-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,810 -
28-3513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0513-11H

17-0513-11H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3,092 -
17-0513-11H

Datasheet

Bulk 0513 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0503-21

06-0503-21

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2,415 -
06-0503-21

Datasheet

Bulk 0503 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
06-0503-31

06-0503-31

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2,798 -
06-0503-31

Datasheet

Bulk 0503 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
22-4518-10H

22-4518-10H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,747 -
22-4518-10H

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0518-00

23-0518-00

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,461 -
23-0518-00

Datasheet

Bulk 518 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
33-0518-11

33-0518-11

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2,286 -
33-0518-11

Datasheet

Bulk 518 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0517-90C

13-0517-90C

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2,044 -
13-0517-90C

Datasheet

Bulk 0517 Active SIP 13 (1 x 13) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0501-20

08-0501-20

CONN SOCKET SIP 8POS TIN

Aries Electronics

3,363 -
08-0501-20

Datasheet

Bulk 501 Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-0501-30

08-0501-30

CONN SOCKET SIP 8POS TIN

Aries Electronics

2,684 -
08-0501-30

Datasheet

Bulk 501 Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-3513-11

22-3513-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,332 -
22-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
39-0518-10H

39-0518-10H

CONN SOCKET SIP 39POS GOLD

Aries Electronics

3,036 -
39-0518-10H

Datasheet

Bulk 518 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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