Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
11-0513-11H

11-0513-11H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2,663 -
11-0513-11H

Datasheet

Bulk 0513 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0513-11

16-0513-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2,082 -
16-0513-11

Datasheet

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0503-20

06-0503-20

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2,420 -
06-0503-20

Datasheet

Bulk 0503 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
06-0503-30

06-0503-30

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,856 -
06-0503-30

Datasheet

Bulk 0503 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
15-0518-00

15-0518-00

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2,019 -
15-0518-00

Datasheet

Bulk 518 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0518-11H

12-0518-11H

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,528 -
12-0518-11H

Datasheet

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-11H

12-1518-11H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,583 -
12-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-10T

28-0518-10T

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2,897 -
28-0518-10T

Datasheet

Bulk 518 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-10T

28-1518-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,499 -
28-1518-10T

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-10H

16-3518-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,166 -
16-3518-10H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-6511-10

08-6511-10

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3,779 -
08-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3513-11

16-3513-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,114 -
16-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6513-10T

20-6513-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,035 -
20-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0503-21

04-0503-21

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2,151 -
04-0503-21

Datasheet

Bulk 0503 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
04-0503-31

04-0503-31

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,651 -
04-0503-31

Datasheet

Bulk 0503 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
21-0518-11

21-0518-11

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,804 -
21-0518-11

Datasheet

Bulk 518 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-10H

26-0518-10H

CONN SOCKET SIP 26POS GOLD

Aries Electronics

2,063 -
26-0518-10H

Datasheet

Bulk 518 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-10H

26-1518-10H

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,906 -
26-1518-10H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
31-0518-10

31-0518-10

CONN SOCKET SIP 31POS GOLD

Aries Electronics

2,338 -
31-0518-10

Datasheet

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-4513-11H

08-4513-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,412 -
08-4513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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