Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果: 21991
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
C9314-02

C9314-02

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,567 -
C9314-02

Datasheet

Bulk Lo-PRO®file, C93 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
52-536-11

52-536-11

CONN SOCKET PLCC ZIF 52POS GOLD

Aries Electronics

3,298 -
- 536 Obsolete PLCC, ZIF (ZIP) 52 (4 x 13) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
32-536-11

32-536-11

CONN SOCKET PLCC ZIF 32POS GOLD

Aries Electronics

2,140 -
- 536 Obsolete PLCC, ZIF (ZIP) 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
20-3540-10

20-3540-10

COLLET PIN CARRIER 20-PIN .300

Aries Electronics

3,495 -
- - Obsolete - - - - - - - - - - - - - -
60-1518-10

60-1518-10

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

2,804 -
60-1518-10

Datasheet

Bulk 518 Obsolete DIP, 0.2 (5.08mm) Row Spacing 60 (2 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
6-513-10

6-513-10

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2,661 -
6-513-10

Datasheet

Bulk 0513 Obsolete SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-823-90CV0

14-823-90CV0

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,385 -
Bulk Vertisockets™ 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
144-PRS12001-16

144-PRS12001-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,483 -
144-PRS12001-16

Datasheet

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
169-PRS13001-16

169-PRS13001-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,499 -
Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
1109253

1109253

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2,252 -
- - Active - - - - - - - - - - - - - -
1110729-24

1110729-24

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

3,545 -
- - Active - - - - - - - - - - - - - -
7410-101-10

7410-101-10

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2,968 -
- - Active - - - - - - - - - - - - - -
28-6553-16

28-6553-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2,206 -
28-6553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
1109927-28

1109927-28

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2,126 -
- - Active - - - - - - - - - - - - - -
1109906-40

1109906-40

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2,010 -
- - Active - - - - - - - - - - - - - -
1108254-48

1108254-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

3,674 -
- - Active - - - - - - - - - - - - - -
1109906-48

1109906-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2,340 -
- - Active - - - - - - - - - - - - - -
1109927-48

1109927-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2,678 -
- - Active - - - - - - - - - - - - - -
1107871-48

1107871-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2,369 -
- - Active - - - - - - - - - - - - - -
1109741-48

1109741-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

3,813 -
- - Active - - - - - - - - - - - - - -
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