Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-8400-610C

20-8400-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,984 -
20-8400-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8500-610C

20-8500-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,104 -
20-8500-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8675-610C

20-8675-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,568 -
20-8675-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8724-610C

20-8724-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,527 -
20-8724-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8950-610C

20-8950-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,930 -
20-8950-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
66-PGM11054-10

66-PGM11054-10

CONN SOCKET PGA GOLD

Aries Electronics

3,071 -
66-PGM11054-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6556-10

40-6556-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,653 -
40-6556-10

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
68-PGM11032-10

68-PGM11032-10

CONN SOCKET PGA GOLD

Aries Electronics

2,418 -
68-PGM11032-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
68-PGM11033-10

68-PGM11033-10

CONN SOCKET PGA GOLD

Aries Electronics

3,132 -
68-PGM11033-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
68-PGM10006-10

68-PGM10006-10

CONN SOCKET PGA GOLD

Aries Electronics

3,612 -
Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0508-20

34-0508-20

CONN SOCKET SIP 34POS GOLD

Aries Electronics

2,769 -
34-0508-20

Datasheet

Bulk 508 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
34-0508-30

34-0508-30

CONN SOCKET SIP 34POS GOLD

Aries Electronics

3,798 -
34-0508-30

Datasheet

Bulk 508 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
34-1508-20

34-1508-20

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

2,683 -
34-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
34-1508-30

34-1508-30

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

2,021 -
34-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
16-6503-21

16-6503-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,607 -
16-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-6503-31

16-6503-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,440 -
16-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-0503-21

18-0503-21

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2,379 -
18-0503-21

Datasheet

Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
18-0503-31

18-0503-31

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2,573 -
18-0503-31

Datasheet

Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
21-7438-10

21-7438-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

3,894 -
21-7438-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-7530-10

21-7530-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

2,434 -
21-7530-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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