Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-41-308-41-001000

110-41-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,368 -
110-41-308-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
SA183040

SA183040

CONN IC DIP SOCKET 18POS GOLD

On Shore Technology Inc.

3,568 -
SA183040

Datenblatt

Tube SA Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled
24-526-10

24-526-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,942 -
24-526-10

Datenblatt

Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
110-99-318-41-001000

110-99-318-41-001000

CONN IC DIP SOCKET 18POS TINLEAD

Mill-Max Manufacturing Corp.

2,890 -
110-99-318-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-820-90C

20-820-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

100 -
20-820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6554-10

24-6554-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

187 -
24-6554-10

Datenblatt

Tube 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
ICF-640-S-O

ICF-640-S-O

CONN IC DIP SOCKET 40POS TIN

Samtec Inc.

794 -
ICF-640-S-O

Datenblatt

Tube iCF Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
110-99-320-41-001000

110-99-320-41-001000

CONN IC DIP SOCKET 20POS TINLEAD

Mill-Max Manufacturing Corp.

785 -
110-99-320-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-6554-10

28-6554-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

2,031 -
28-6554-10

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
MPP-1100-05-DS-4GR(S1402)

MPP-1100-05-DS-4GR(S1402)

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions

2,906 -
MPP-1100-05-DS-4GR(S1402)

Datenblatt

Tray - Active Transistor, TO-220 and TO-247 5 (Rectangular) - Gold 30.0µin (0.76µm) Nickel Boron Through Hole, Right Angle - Solder - Gold 30.0µin (0.76µm) Nickel Boron Polyphenylene Sulfide (PPS)
110-44-328-41-001000

110-44-328-41-001000

CONN IC DIP SOCKET 28POS TIN

Mill-Max Manufacturing Corp.

3,748 -
110-44-328-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-328-41-001000

110-99-328-41-001000

CONN IC DIP SOCKET 28POS TINLEAD

Mill-Max Manufacturing Corp.

2,068 -
110-99-328-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
218-3341-00-0602J

218-3341-00-0602J

CONN IC DIP SOCKET ZIF 18POS GLD

3M

3,167 -
218-3341-00-0602J

Datenblatt

Tray Textool™ Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
8080-1G7

8080-1G7

CONN TRANSIST TO-3 4POS GOLD

TE Connectivity AMP Connectors

2,839 -
8080-1G7

Datenblatt

Bulk 8080 Active Transistor, TO-3 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Fluoropolymer (FP)
SA486000

SA486000

CONN IC DIP SOCKET 48POS GOLD

On Shore Technology Inc.

3,315 -
SA486000

Datenblatt

Tube SA Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled
222-3343-00-0602J

222-3343-00-0602J

CONN IC DIP SOCKET ZIF 22POS GLD

3M

3,739 -
222-3343-00-0602J

Datenblatt

Tube Textool™ Active DIP, ZIF (ZIP), 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-1277-00-0602J

228-1277-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

3,711 -
228-1277-00-0602J

Datenblatt

Bulk,Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
123-87-316-41-001101

123-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,086 -
123-87-316-41-001101

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-3513-10

10-3513-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,325 -
10-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
224-1286-00-0602J

224-1286-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M

2,483 -
224-1286-00-0602J

Datenblatt

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
Total 21991 Record«Prev1... 3132333435363738...1100Next»
HEIM

HEIM

PRODUKT

PRODUKT

TELEFON

TELEFON

BENUTZER

BENUTZER