Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-47-308-41-006000

116-47-308-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,929 -
116-47-308-41-006000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-314-10-001000

110-93-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,793 -
110-93-314-10-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-310-41-001000

612-11-310-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,177 -
612-11-310-41-001000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-306-41-770000

104-11-306-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,506 -
104-11-306-41-770000

Datenblatt

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-6501-21

18-6501-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,000 -
18-6501-21

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-6501-31

18-6501-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,483 -
18-6501-31

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-93-308-41-605000

110-93-308-41-605000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2,414 -
110-93-308-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-308-41-605000

110-43-308-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,620 -
110-43-308-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-314-41-001000

210-41-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,858 -
210-41-314-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-314-41-001000

210-91-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,429 -
210-91-314-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-308-41-013000

146-41-308-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,572 -
146-41-308-41-013000

Datenblatt

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-308-41-013000

146-91-308-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,574 -
146-91-308-41-013000

Datenblatt

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-310-41-001000

122-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,153 -
122-13-310-41-001000

Datenblatt

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-310-41-007000

116-47-310-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,043 -
116-47-310-41-007000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-99-320-41-001000

210-99-320-41-001000

CONN IC DIP SOCKET 20POS TINLEAD

Mill-Max Manufacturing Corp.

3,758 -
210-99-320-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-44-320-41-001000

210-44-320-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,660 -
210-44-320-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-310-41-004000

612-43-310-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,026 -
612-43-310-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-310-41-004000

612-93-310-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,150 -
612-93-310-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-80-124-13-041101

550-80-124-13-041101

PGA SOLDER TAIL

Preci-Dip

3,671 -
550-80-124-13-041101

Datenblatt

Bulk 550 Active PGA 124 (13 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-0508-21

14-0508-21

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,904 -
14-0508-21

Datenblatt

Bulk 508 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
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