Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
ICF-308-S-O-TR

ICF-308-S-O-TR

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

350 -
ICF-308-S-O-TR

Datenblatt

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
ICF-624-T-O-TR

ICF-624-T-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

271 -
Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
1-1571552-2

1-1571552-2

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors

142 -
1-1571552-2

Datenblatt

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
AR 28-HZL/07/7-TT

AR 28-HZL/07/7-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

1,765 -
AR 28-HZL/07/7-TT

Datenblatt

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
816-AG11D

816-AG11D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

960 -
816-AG11D

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
516-AG12D-LF

516-AG12D-LF

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors

1,173 -
516-AG12D-LF

Datenblatt

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
822-AG11D

822-AG11D

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

1,669 -
822-AG11D

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
818-AG11D

818-AG11D

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

432 -
818-AG11D

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
614-43-324-31-012000

614-43-324-31-012000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

201 -
614-43-324-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1-1571994-0

1-1571994-0

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

118 -
1-1571994-0

Datenblatt

Tube 510 Obsolete SIP 10 (1 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester
516-AG11D

516-AG11D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

315 -
516-AG11D

Datenblatt

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
816-AG10D-ES

816-AG10D-ES

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

909 -
816-AG10D-ES

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Copper Alloy Polyester
299-43-306-10-001000

299-43-306-10-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

303 -
299-43-306-10-001000

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-430-41-005000

117-43-430-41-005000

CONN IC DIP SOCKET 30POS GOLD

Mill-Max Manufacturing Corp.

143 -
117-43-430-41-005000

Datenblatt

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-328-31-012000

614-43-328-31-012000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

112 -
614-43-328-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
824-AG30D-ES

824-AG30D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

760 -
824-AG30D-ES

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
299-43-318-11-001000

299-43-318-11-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

197 -
299-43-318-11-001000

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
524-AG10D-ES

524-AG10D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

213 -
524-AG10D-ES

Datenblatt

Tube 500 Obsolete DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass -
540-AG11D-ES

540-AG11D-ES

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

226 -
540-AG11D-ES

Datenblatt

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
299-43-614-10-002000

299-43-614-10-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

201 -
299-43-614-10-002000

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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