Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-0503-20

14-0503-20

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,637 -
14-0503-20

Datenblatt

Bulk 0503 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
14-0503-30

14-0503-30

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,654 -
14-0503-30

Datenblatt

Bulk 0503 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
06-810-90C

06-810-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,363 -
06-810-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-810-90C

08-810-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,850 -
08-810-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-153-15-061101

510-83-153-15-061101

CONN SOCKET PGA 153POS GOLD

Preci-Dip

3,161 -
510-83-153-15-061101

Datenblatt

Bulk 510 Active PGA 153 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-93-664-41-005000

117-93-664-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

2,255 -
117-93-664-41-005000

Datenblatt

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
27-0518-11H

27-0518-11H

CONN SOCKET SIP 27POS GOLD

Aries Electronics

3,794 -
27-0518-11H

Datenblatt

Bulk 518 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-432-41-013101

116-83-432-41-013101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,203 -
116-83-432-41-013101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-013101

116-83-632-41-013101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,634 -
116-83-632-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
22-3513-10H

22-3513-10H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,560 -
22-3513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6513-10H

20-6513-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,897 -
20-6513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-4820-90C

10-4820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,804 -
10-4820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6820-90C

10-6820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,332 -
10-6820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6822-90C

10-6822-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,247 -
10-6822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6823-90C

10-6823-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,238 -
10-6823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-41-304-31-012000

614-41-304-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,451 -
614-41-304-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-304-31-012000

614-91-304-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,539 -
614-91-304-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-308-G-Q

APA-308-G-Q

ADAPTER PLUG

Samtec Inc.

2,342 -
Tube APA Active - 8 (2 x 4) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
346-93-142-41-013000

346-93-142-41-013000

CONN SOCKET SIP 42POS GOLD

Mill-Max Manufacturing Corp.

3,093 -
346-93-142-41-013000

Datenblatt

Bulk 346 Active SIP 42 (1 x 42) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-142-41-013000

346-43-142-41-013000

CONN SOCKET SIP 42POS GOLD

Mill-Max Manufacturing Corp.

2,439 -
346-43-142-41-013000

Datenblatt

Bulk 346 Active SIP 42 (1 x 42) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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