Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
APA-324-T-N

APA-324-T-N

ADAPTER PLUG

Samtec Inc.

2,136 -
Tube APA Active - 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-624-T-N

APA-624-T-N

ADAPTER PLUG

Samtec Inc.

3,673 -
Tube APA Active - 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
550-80-069-11-001101

550-80-069-11-001101

PGA SOLDER TAIL

Preci-Dip

3,954 -
550-80-069-11-001101

Datenblatt

Bulk 550 Active PGA 69 (11 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-069-11-061101

550-80-069-11-061101

PGA SOLDER TAIL

Preci-Dip

2,754 -
550-80-069-11-061101

Datenblatt

Bulk 550 Active PGA 69 (11 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
18-6513-10H

18-6513-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,906 -
18-6513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-9513-11

20-9513-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,269 -
20-9513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2822-90

08-2822-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,626 -
08-2822-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
08-2823-90

08-2823-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,324 -
08-2823-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
08-820-90

08-820-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,743 -
08-820-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
08-822-90

08-822-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,740 -
08-822-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
17-0517-90C

17-0517-90C

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,473 -
17-0517-90C

Datenblatt

Bulk 0517 Active SIP 17 (1 x 17) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-47-304-41-007000

116-47-304-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,146 -
116-47-304-41-007000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-146-15-061101

510-83-146-15-061101

CONN SOCKET PGA 146POS GOLD

Preci-Dip

2,309 -
510-83-146-15-061101

Datenblatt

Bulk 510 Active PGA 146 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-127-31-018000

714-43-127-31-018000

CONN SOCKET SIP 27POS GOLD

Mill-Max Manufacturing Corp.

2,109 -
714-43-127-31-018000

Datenblatt

Bulk 714 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-304-41-002000

126-41-304-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,618 -
126-41-304-41-002000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-304-41-002000

126-91-304-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,764 -
126-91-304-41-002000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-632-41-013101

116-87-632-41-013101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,966 -
116-87-632-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
104-11-304-41-770000

104-11-304-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,535 -
104-11-304-41-770000

Datenblatt

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
08-2810-90C

08-2810-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,780 -
08-2810-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-304-41-003000

116-93-304-41-003000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

2,293 -
116-93-304-41-003000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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