Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
346-93-136-41-013000

346-93-136-41-013000

CONN SOCKET SIP 36POS GOLD

Mill-Max Manufacturing Corp.

2,185 -
346-93-136-41-013000

Datenblatt

Bulk 346 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-136-41-013000

346-43-136-41-013000

CONN SOCKET SIP 36POS GOLD

Mill-Max Manufacturing Corp.

3,201 -
346-43-136-41-013000

Datenblatt

Bulk 346 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
50-9518-10

50-9518-10

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

3,452 -
50-9518-10

Datenblatt

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-6513-10

36-6513-10

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,656 -
36-6513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-00

27-0518-00

CONN SOCKET SIP 27POS GOLD

Aries Electronics

3,923 -
27-0518-00

Datenblatt

Bulk 518 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0518-11H

23-0518-11H

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,648 -
23-0518-11H

Datenblatt

Bulk 518 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-628-41-013101

116-87-628-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,469 -
116-87-628-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-316-T-B

APA-316-T-B

ADAPTER PLUG

Samtec Inc.

3,403 -
Bulk APA Active - 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
299-83-624-10-002101

299-83-624-10-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,608 -
299-83-624-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-132-14-001101

510-83-132-14-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

2,832 -
510-83-132-14-001101

Datenblatt

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-002101

510-87-223-18-002101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2,335 -
510-87-223-18-002101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-091101

510-87-223-18-091101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

3,178 -
510-87-223-18-091101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-092101

510-87-223-18-092101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2,884 -
510-87-223-18-092101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-093101

510-87-223-18-093101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2,888 -
510-87-223-18-093101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-094101

510-87-223-18-094101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

3,786 -
510-87-223-18-094101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-001101

116-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,266 -
116-87-648-41-001101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-132-14-071101

510-83-132-14-071101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

3,973 -
510-83-132-14-071101

Datenblatt

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-628-10-002101

299-87-628-10-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,065 -
299-87-628-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-224-18-091101

510-87-224-18-091101

CONN SOCKET PGA 224POS GOLD

Preci-Dip

3,407 -
510-87-224-18-091101

Datenblatt

Bulk 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-964-41-001101

612-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

3,838 -
612-83-964-41-001101

Datenblatt

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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