Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-87-964-41-001101

612-87-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

2,989 -
612-87-964-41-001101

Datenblatt

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-160-15-061101

510-87-160-15-061101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

3,263 -
510-87-160-15-061101

Datenblatt

Bulk 510 Active PGA 160 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-160-16-081101

510-87-160-16-081101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

3,349 -
510-87-160-16-081101

Datenblatt

Bulk 510 Active PGA 160 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-620-10-002101

299-87-620-10-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,953 -
299-87-620-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-324-SST

ICO-324-SST

100 LOW PROFILE SCREW MACHINE D

Samtec Inc.

2,721 -
Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
510-83-101-13-001101

510-83-101-13-001101

CONN SOCKET PGA 101POS GOLD

Preci-Dip

2,744 -
510-83-101-13-001101

Datenblatt

Bulk 510 Active PGA 101 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-101-13-061101

510-83-101-13-061101

CONN SOCKET PGA 101POS GOLD

Preci-Dip

3,557 -
510-83-101-13-061101

Datenblatt

Bulk 510 Active PGA 101 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-101-11-001101

510-83-101-11-001101

CONN SOCKET PGA 101POS GOLD

Preci-Dip

3,554 -
510-83-101-11-001101

Datenblatt

Bulk 510 Active PGA 101 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-004101

116-87-628-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,098 -
116-87-628-41-004101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
18-0513-11H

18-0513-11H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2,829 -
18-0513-11H

Datenblatt

Bulk 0513 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0518-10H

34-0518-10H

CONN SOCKET SIP 34POS GOLD

Aries Electronics

2,852 -
34-0518-10H

Datenblatt

Bulk 518 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-1518-10H

34-1518-10H

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3,770 -
34-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-640-41-008101

116-83-640-41-008101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,295 -
116-83-640-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICA-316-SGG

ICA-316-SGG

CONN IC DIP SOCKET 16POS GOLD

Samtec Inc.

2,166 -
ICA-316-SGG

Datenblatt

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyester, Glass Filled
116-87-640-41-011101

116-87-640-41-011101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3,943 -
116-87-640-41-011101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-3511-11

08-3511-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,218 -
08-3511-11

Datenblatt

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-101

16-3518-101

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,261 -
16-3518-101

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-126-41-013000

346-93-126-41-013000

CONN SOCKET SIP 26POS GOLD

Mill-Max Manufacturing Corp.

3,652 -
346-93-126-41-013000

Datenblatt

Bulk 346 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-126-41-013000

346-43-126-41-013000

CONN SOCKET SIP 26POS GOLD

Mill-Max Manufacturing Corp.

3,477 -
346-43-126-41-013000

Datenblatt

Bulk 346 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-216-31-018000

714-43-216-31-018000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2,429 -
714-43-216-31-018000

Datenblatt

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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