Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
26-1518-10H

26-1518-10H

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,906 -
26-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
31-0518-10

31-0518-10

CONN SOCKET SIP 31POS GOLD

Aries Electronics

2,338 -
31-0518-10

Datenblatt

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-314-41-013101

116-83-314-41-013101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,974 -
116-83-314-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-636-41-001101

122-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,858 -
122-87-636-41-001101

Datenblatt

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-636-41-001101

123-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,365 -
123-87-636-41-001101

Datenblatt

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-432-41-001101

122-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,252 -
122-83-432-41-001101

Datenblatt

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-632-41-001101

122-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,166 -
122-83-632-41-001101

Datenblatt

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-432-41-001101

123-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,073 -
123-83-432-41-001101

Datenblatt

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-632-41-001101

123-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,865 -
123-83-632-41-001101

Datenblatt

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-114-13-001101

510-87-114-13-001101

CONN SOCKET PGA 114POS GOLD

Preci-Dip

3,109 -
510-87-114-13-001101

Datenblatt

Bulk 510 Active PGA 114 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-114-13-061101

510-87-114-13-061101

CONN SOCKET PGA 114POS GOLD

Preci-Dip

3,948 -
510-87-114-13-061101

Datenblatt

Bulk 510 Active PGA 114 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-4513-11H

08-4513-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,412 -
08-4513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-10T

24-0513-10T

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2,217 -
24-0513-10T

Datenblatt

Bulk 0513 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-83-652-41-001101

115-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3,849 -
Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-952-41-001101

115-83-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2,593 -
Bulk 115 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-318-10-001101

299-83-318-10-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,420 -
299-83-318-10-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-640-31-012101

614-83-640-31-012101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3,321 -
614-83-640-31-012101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-003101

116-83-636-41-003101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,343 -
116-83-636-41-003101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-114-13-062101

510-87-114-13-062101

CONN SOCKET PGA 114POS GOLD

Preci-Dip

3,755 -
510-87-114-13-062101

Datenblatt

Bulk 510 Active PGA 114 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-320-10-001101

299-87-320-10-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,743 -
299-87-320-10-001101

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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