Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
XR2T-1621-N

XR2T-1621-N

CONN IC DIP SOCKET 16POS GOLD

Omron Electronics Inc-EMC Div

2,550 -
XR2T-1621-N

Datenblatt

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
06-6513-11H

06-6513-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,810 -
06-6513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-9513-10T

10-9513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,401 -
10-9513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-00

20-3518-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,572 -
20-3518-00

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-4518-00

20-4518-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,658 -
20-4518-00

Datenblatt

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
146-87-636-41-035101

146-87-636-41-035101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,576 -
146-87-636-41-035101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-636-41-036101

146-87-636-41-036101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,906 -
146-87-636-41-036101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-068-10-061101

510-83-068-10-061101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2,800 -
510-83-068-10-061101

Datenblatt

Bulk 510 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
18-3518-11

18-3518-11

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,282 -
18-3518-11

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-328-41-007101

116-83-328-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,009 -
116-83-328-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-007101

116-83-428-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,201 -
116-83-428-41-007101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-007101

116-83-628-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,977 -
116-83-628-41-007101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-648-41-001101

115-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,281 -
Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
214-44-314-01-670799

214-44-314-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

2,474 -
Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
214-99-314-01-670799

214-99-314-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

3,525 -
Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
346-93-117-41-013000

346-93-117-41-013000

CONN SOCKET SIP 17POS GOLD

Mill-Max Manufacturing Corp.

2,207 -
346-93-117-41-013000

Datenblatt

Bulk 346 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-117-41-013000

346-43-117-41-013000

CONN SOCKET SIP 17POS GOLD

Mill-Max Manufacturing Corp.

2,458 -
346-43-117-41-013000

Datenblatt

Bulk 346 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-432-41-009101

116-87-432-41-009101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,670 -
116-87-432-41-009101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-009101

116-87-632-41-009101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,977 -
116-87-632-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-320-T-J

APA-320-T-J

ADAPTER PLUG

Samtec Inc.

3,874 -
Tube APA Active - 20 (2 x 10) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
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