Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
22-1518-10T

22-1518-10T

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,539 -
22-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-10

24-1518-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,255 -
24-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0508-21

03-0508-21

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,657 -
03-0508-21

Datenblatt

Bulk 508 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
03-0508-31

03-0508-31

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,519 -
03-0508-31

Datenblatt

Bulk 508 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
116-87-636-41-003101

116-87-636-41-003101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,627 -
116-87-636-41-003101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-642-41-001101

612-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2,577 -
612-87-642-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-624-41-801101

110-83-624-41-801101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,006 -
110-83-624-41-801101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-002101

116-87-428-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,295 -
116-87-428-41-002101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-13-001101

510-87-085-13-001101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,461 -
510-87-085-13-001101

Datenblatt

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-13-042101

510-87-085-13-042101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,417 -
510-87-085-13-042101

Datenblatt

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-13-081101

510-87-085-13-081101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2,703 -
510-87-085-13-081101

Datenblatt

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-018101

116-83-428-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,264 -
116-83-428-41-018101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-624-41-001101

122-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,209 -
122-83-624-41-001101

Datenblatt

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-624-41-001101

123-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,254 -
123-83-624-41-001101

Datenblatt

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-011101

116-83-320-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,642 -
116-83-320-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-012101

116-87-432-41-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,451 -
116-87-432-41-012101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-002101

116-83-324-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,327 -
116-83-324-41-002101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-002101

116-83-424-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,281 -
116-83-424-41-002101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-001101

116-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,424 -
116-83-322-41-001101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-432-31-012101

614-83-432-31-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,276 -
614-83-432-31-012101

Datenblatt

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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