Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-83-636-41-003101

115-83-636-41-003101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,802 -
115-83-636-41-003101

Datenblatt

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-316-LTT

ICO-316-LTT

CONN IC DIP SOCKET 16POS TIN

Samtec Inc.

3,789 -
ICO-316-LTT

Datenblatt

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
116-83-424-41-012101

116-83-424-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,540 -
116-83-424-41-012101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-012101

116-83-624-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,331 -
116-83-624-41-012101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-002101

116-87-328-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,037 -
116-87-328-41-002101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-11-001101

510-87-085-11-001101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2,191 -
510-87-085-11-001101

Datenblatt

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-11-041101

510-87-085-11-041101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,842 -
510-87-085-11-041101

Datenblatt

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-11-044101

510-87-085-11-044101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2,640 -
510-87-085-11-044101

Datenblatt

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-11-045101

510-87-085-11-045101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,675 -
510-87-085-11-045101

Datenblatt

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-10-031101

510-87-085-10-031101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2,452 -
510-87-085-10-031101

Datenblatt

Bulk 510 Active PGA 85 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-018101

116-83-628-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,234 -
116-83-628-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-324-41-001101

122-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,817 -
122-83-324-41-001101

Datenblatt

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-424-41-001101

122-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,383 -
122-83-424-41-001101

Datenblatt

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-424-41-001101

123-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,465 -
123-83-424-41-001101

Datenblatt

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-640-41-001101

614-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,175 -
614-87-640-41-001101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-93-422-41-003000

115-93-422-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2,479 -
115-93-422-41-003000

Datenblatt

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
17-0513-10T

17-0513-10T

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3,870 -
17-0513-10T

Datenblatt

Bulk 0513 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-1518-10T

20-1518-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,912 -
20-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-1518-10

22-1518-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,949 -
22-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
ICF-320-T-O-TR

ICF-320-T-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,011 -
Tape & Reel (TR) iCF Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
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