Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-87-648-41-001101

110-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,861 -
110-87-648-41-001101

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-648-41-001151

110-87-648-41-001151

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,732 -
Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-013101

116-87-610-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,075 -
116-87-610-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-013101

116-83-310-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,181 -
116-83-310-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-081-09-000101

510-87-081-09-000101

CONN SOCKET PGA 81POS GOLD

Preci-Dip

3,679 -
510-87-081-09-000101

Datenblatt

Bulk 510 Active PGA 81 (9 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-4513-10

12-4513-10

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,853 -
12-4513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0513-11H

07-0513-11H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,226 -
07-0513-11H

Datenblatt

Bulk 0513 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0513-10T

15-0513-10T

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3,573 -
15-0513-10T

Datenblatt

Bulk 0513 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-00

14-3518-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,186 -
14-3518-00

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-328-41-006101

116-83-328-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,211 -
116-83-328-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-648-41-001101

115-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,496 -
Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
18-1518-10T

18-1518-10T

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,847 -
18-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-324-41-012101

116-83-324-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,747 -
116-83-324-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-41-105161

110-83-328-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,193 -
110-83-328-41-105161

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-628-41-105161

110-83-628-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,724 -
110-83-628-41-105161

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-001101

116-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,042 -
116-83-318-41-001101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-3511-10

14-3511-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,039 -
14-3511-10

Datenblatt

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-049-07-000101

510-83-049-07-000101

CONN SOCKET PGA 49POS GOLD

Preci-Dip

3,069 -
510-83-049-07-000101

Datenblatt

Bulk 510 Active PGA 49 (7 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-636-41-005101

110-83-636-41-005101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,228 -
110-83-636-41-005101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-640-41-001101

110-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,931 -
110-83-640-41-001101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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