Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-320-41-003101

116-83-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,343 -
116-83-320-41-003101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-642-41-005101

110-87-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,897 -
110-87-642-41-005101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-012101

116-83-318-41-012101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,456 -
116-83-318-41-012101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-006101

116-83-322-41-006101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,587 -
116-83-322-41-006101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-328-41-117101

114-83-328-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,570 -
114-83-328-41-117101

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-328-41-134161

114-83-328-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,087 -
114-83-328-41-134161

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-428-41-001101

115-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,726 -
Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-420-41-035101

146-87-420-41-035101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,367 -
146-87-420-41-035101

Datasheet

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-420-41-036101

146-87-420-41-036101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,657 -
146-87-420-41-036101

Datasheet

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-001101

116-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,183 -
116-83-314-41-001101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-640-41-001101

115-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,946 -
Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-068-17-400-2

540-88-068-17-400-2

CONN SOCKET PLCC 68POS TIN

Preci-Dip

3,181 -
540-88-068-17-400-2

Datasheet

Bulk 540 Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
110-87-636-41-001101

110-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,067 -
110-87-636-41-001101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-105191

110-83-320-41-105191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,790 -
Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-018101

116-87-328-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,750 -
116-87-328-41-018101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-432-41-001101

614-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,097 -
614-87-432-41-001101

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-328-31-012101

614-87-328-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,546 -
614-87-328-31-012101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-068-24-008

540-88-068-24-008

CONN SOCKET PLCC 68POS TIN

Preci-Dip

3,436 -
540-88-068-24-008

Datasheet

Bulk 540 Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
116-83-316-41-002101

116-83-316-41-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,543 -
116-83-316-41-002101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-640-41-005101

117-87-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,407 -
117-87-640-41-005101

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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