Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
517-83-364-17-091111

517-83-364-17-091111

CONN SOCKET PGA 364POS GOLD

Preci-Dip

2,541 -
517-83-364-17-091111

Datasheet

Bulk 517 Active PGA 364 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-192M16-001152

550-10-192M16-001152

BGA SOLDER TAIL

Preci-Dip

3,886 -
550-10-192M16-001152

Datasheet

Bulk 550 Active BGA 192 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
517-83-369-18-091111

517-83-369-18-091111

CONN SOCKET PGA 369POS GOLD

Preci-Dip

3,190 -
517-83-369-18-091111

Datasheet

Bulk 517 Active PGA 369 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-257-20-111117

514-87-257-20-111117

CONN SOCKET PGA 257POS GOLD

Preci-Dip

3,103 -
514-87-257-20-111117

Datasheet

Bulk 514 Active PGA 257 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-225-18-091101

550-80-225-18-091101

PGA SOLDER TAIL

Preci-Dip

2,851 -
550-80-225-18-091101

Datasheet

Bulk 550 Active PGA 225 (18 x 18) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-175-16-072112

614-83-175-16-072112

CONN SOCKET PGA 175POS GOLD

Preci-Dip

2,912 -
614-83-175-16-072112

Datasheet

Bulk 614 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-528-21-121111

517-87-528-21-121111

CONN SOCKET PGA 528POS GOLD

Preci-Dip

2,787 -
517-87-528-21-121111

Datasheet

Bulk 517 Active PGA 528 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-529-21-121111

517-87-529-21-121111

CONN SOCKET PGA 529POS GOLD

Preci-Dip

2,820 -
517-87-529-21-121111

Datasheet

Bulk 517 Active PGA 529 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-223-18-091117

514-83-223-18-091117

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2,752 -
514-83-223-18-091117

Datasheet

Bulk 514 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-179-18-111112

614-83-179-18-111112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

3,872 -
614-83-179-18-111112

Datasheet

Bulk 614 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-179-18-112112

614-83-179-18-112112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,075 -
614-83-179-18-112112

Datasheet

Bulk 614 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-419-19-001154

514-87-419-19-001154

CONN SOCKET PGA 419POS GOLD

Preci-Dip

2,757 -
514-87-419-19-001154

Datasheet

Bulk 514 Active PGA 419 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-179-15-041112

614-83-179-15-041112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,086 -
614-83-179-15-041112

Datasheet

Bulk 614 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-255M16-001148

514-87-255M16-001148

CONN SOCKET BGA 255POS GOLD

Preci-Dip

3,563 -
514-87-255M16-001148

Datasheet

Bulk 514 Active BGA 255 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-391-18-101111

517-83-391-18-101111

CONN SOCKET PGA 391POS GOLD

Preci-Dip

3,402 -
517-83-391-18-101111

Datasheet

Bulk 517 Active PGA 391 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-169-17-101101

550-10-169-17-101101

PGA SOLDER TAIL

Preci-Dip

3,536 -
550-10-169-17-101101

Datasheet

Bulk 550 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-539-20-101111

517-87-539-20-101111

CONN SOCKET PGA 539POS GOLD

Preci-Dip

3,328 -
517-87-539-20-101111

Datasheet

Bulk 517 Active PGA 539 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-256M16-000148

514-87-256M16-000148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

3,374 -
514-87-256M16-000148

Datasheet

Bulk 514 Active BGA 256 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-256M20-001148

514-87-256M20-001148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

2,348 -
514-87-256M20-001148

Datasheet

Bulk 514 Active BGA 256 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-192M16-001101

558-10-192M16-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,619 -
558-10-192M16-001101

Datasheet

Bulk 558 Active PGA 192 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
Total 2821 Record«Prev1... 122123124125126127128129...142Next»
HEIM

HEIM

PRODUKT

PRODUKT

TELEFON

TELEFON

BENUTZER

BENUTZER