RFI und EMI – Kontakte, Fingerstock und Dichtungen

制造商 Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod










































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
4094PA51H03937

4094PA51H03937

GK,NICU,PTAFG,PU,V0,REC .080X.16

Laird Technologies EMI

2,984 -
Bulk 51H Active Fabric Over Foam Rectangle 0.160 (4.06mm) 39.370 (1.00m) 0.080 (2.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0077003317

0077003317

NOSG,STR,SNB,PSA

Laird Technologies EMI

3,234 -
0077003317

Datenblatt

Bulk No Snag Active Fingerstock - 0.370 (9.40mm) 16.000 (406.40mm) 0.130 (3.30mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0077003319

0077003319

NOSG,STR,NIB,PSA

Laird Technologies EMI

3,216 -
0077003319

Datenblatt

Bulk No Snag Active Fingerstock - 0.370 (9.40mm) 15.984 (406.00mm) 0.130 (3.30mm) Beryllium Copper Nickel 299.99µin (7.62µm) Tape
4046PA51H03937

4046PA51H03937

GK,NICU,PTAFG,PU,V0,SQ 3X3X1000M

Laird Technologies EMI

2,377 -
Bulk 51H Active Fabric Over Foam Square 0.118 (3.00mm) 39.370 (1.00m) 0.118 (3.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4246PA50104800

4246PA50104800

GK NICU PTAF PU NR REC

Laird Technologies EMI

2,239 -
4246PA50104800

Datenblatt

Bulk 501 Active Fabric Over Foam Rectangle 0.091 (2.30mm) 48.000 (121.92cm) 0.051 (1.30mm) - - - Adhesive
0C98055517

0C98055517

TWT COIL SNB USF PSA

Laird Technologies EMI

2,065 -
Bulk Ultrasoft Twist Active Fingerstock - 0.340 (8.64mm) 24.000 (609.60mm) 0.070 (1.78mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
4220PA51H03937

4220PA51H03937

GK,NICU,PTAF,PU,V0,REC 1.0X5.0X1

Laird Technologies EMI

3,605 -
Bulk 51H Active Fabric Over Foam Rectangle 0.200 (5.08mm) 39.370 (1.00m) 0.040 (1.02mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4742PA51H03937

4742PA51H03937

GK,NICU,PTAFG,PU,V0,DSH .120X.15

Laird Technologies EMI

3,832 -
Bulk 51H Active Fabric Over Foam D-Shape 0.150 (3.81mm) 39.370 (1.00m) 0.120 (3.05mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
8905017846

8905017846

EGW,SS .062X.125X.200

Laird Technologies EMI

2,343 -
Bulk - Active - - - - - - - - -
4048PA51G01800

4048PA51G01800

SQUARE

Laird Technologies EMI

2,222 -
4048PA51G01800

Datenblatt

Bulk 51G Active Fabric Over Foam Square 0.236 (6.00mm) 18.000 (457.20mm) 0.236 (6.00mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive
0077008617

0077008617

NOSG,STR,SNB,PSA

Laird Technologies EMI

2,079 -
0077008617

Datenblatt

Bulk No Snag Active Fingerstock - 0.320 (8.13mm) 16.000 (406.40mm) 0.090 (2.29mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
4520PA51H03937

4520PA51H03937

GK,NICU,PTAFG,PU,V0,SQ 2X2X1000M

Laird Technologies EMI

3,727 -
Bulk 51H Active Fabric Over Foam Square 0.080 (2.03mm) 39.370 (1.00m) 0.080 (2.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4358PA51H03937

4358PA51H03937

GK,NICU,PTAFG,PU,V0,DSH .060X.09

Laird Technologies EMI

2,401 -
Bulk 51H Active Fabric Over Foam D-Shape 0.098 (2.49mm) 39.370 (1.00m) 0.630 (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4245PA51H03937

4245PA51H03937

GK,NICU,PTAFG,PU,V0,REC 1X3X1000

Laird Technologies EMI

2,824 -
Bulk 51H Active Fabric Over Foam Rectangle 0.120 (3.05mm) 39.370 (1.00m) 0.040 (1.02mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4584PA51H03937

4584PA51H03937

GK,NICU,PTAFG,PU,V0,DSH 1.0X3.8X

Laird Technologies EMI

2,918 -
Bulk 51H Active Fabric Over Foam D-Shape 0.150 (3.81mm) 39.370 (1.00m) 0.040 (1.02mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4246PA51H03937

4246PA51H03937

GK,NICU,PTAFG,PU,V0,REC .050X.09

Laird Technologies EMI

2,117 -
Bulk 51H Active Fabric Over Foam Rectangle 0.090 (2.29mm) 39.370 (1.00m) 0.050 (1.27mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4688PA51H03937

4688PA51H03937

GK,NICU,PTAFG,PU,V0,REC 2X3X1000

Laird Technologies EMI

3,831 -
Bulk 51H Active Fabric Over Foam Rectangle 0.118 (3.00mm) 39.370 (1.00m) 0.079 (2.01mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4053PA51H03937

4053PA51H03937

GK,NICU,PTAFG,PU,V0,DSH .090X.09

Laird Technologies EMI

2,803 -
Bulk 51H Active Fabric Over Foam D-Shape 0.090 (2.29mm) 39.370 (1.00m) 0.090 (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0098061102

0098061102

CLO,STR,TLN,BF,USF

Laird Technologies EMI

2,523 -
0098061102

Datenblatt

Bulk Ultrasoft Clip-On Active Fingerstock - 0.300 (7.62mm) 16.000 (406.40mm) 0.100 (2.54mm) Beryllium Copper - - Clip
0098061302

0098061302

CLO,STR,DLN,BF,USF

Laird Technologies EMI

2,205 -
0098061302

Datenblatt

Bulk Ultrasoft Clip-On Active Fingerstock - 0.300 (7.62mm) 16.000 (406.40mm) 0.100 (2.54mm) Beryllium Copper - - Clip
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