Eingebettete Mikrocontroller Mikroprozessor Fpga Module

制造商 Packaging Series RoHS Speed RAM Size Flash Size Part Status Co-Processor Connector Type Core Processor Size / Dimension Module/Board Type Operating Temperature






































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series RoHS Speed RAM Size Flash Size Part Status Co-Processor Connector Type Core Processor Size / Dimension Module/Board Type Operating Temperature
TE0803-03-4DE21-L

TE0803-03-4DE21-L

MODULE SOM TE0803-03

Trenz Electronic GmbH

2,130 -
TE0803-03-4DE21-L

Datasheet

Bulk TE0803 RoHS - 4GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU4EV-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0803-02-04EG-1E3

TE0803-02-04EG-1E3

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

2,557 -
Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU4EG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0803-02-03-1EA-S

TE0803-02-03-1EA-S

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

2,333 -
Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU3EG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) FPGA Core 0°C ~ 85°C
TE0803-02-03EG-1EA

TE0803-02-03EG-1EA

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

3,228 -
Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU3EG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0803-02-03CG-1EA

TE0803-02-03CG-1EA

MODULE SOM TE0803-02

Trenz Electronic GmbH

2,290 -
Bulk TE0803 RoHS - - - Obsolete - B2B - 2.05" x 2.99" (52mm x 76mm) MPU Core -
TE0803-03-5DI21-A

TE0803-03-5DI21-A

MODULE SOM TE0803-03

Trenz Electronic GmbH

2,117 -
Bulk RoHS - - - Obsolete - - - - - -
TE0803-02-04EG-1ID

TE0803-02-04EG-1ID

MODULE SOM TE0803-02

Trenz Electronic GmbH

2,744 -
Bulk TE0803 RoHS - - - Obsolete - B2B - 2.05" x 2.99" (52mm x 76mm) MPU Core -
TE0803-03-4BE21-L

TE0803-03-4BE21-L

MODULE SOM TE0803-03

Trenz Electronic GmbH

3,714 -
Bulk RoHS - - - Active - - - - - -
TE0803-03-5DE11-A

TE0803-03-5DE11-A

MODULE SOM TE0803-03

Trenz Electronic GmbH

3,650 -
TE0803-03-5DE11-A

Datasheet

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU5EV-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0803-02-05EV-1EA

TE0803-02-05EV-1EA

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

3,025 -
Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU5EV-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0890-01-25-1C

TE0890-01-25-1C

IC MOD SPARTAN-7 100MHZ 64MBIT

Trenz Electronic GmbH

2,113 -
TE0890-01-25-1C

Datasheet

Box TE0890 RoHS 100MHz 64Mbit 64Mbit Obsolete - Dual-pinout DIP-40 or 50mil 80 pin connector Xilinx Spartan-7 XC7S25 1.06" x 2.05" (27.0mm x 52.0mm) FPGA Core 0°C ~ 70°C
TE0745-02-81C11-A

TE0745-02-81C11-A

SOM MIT XILINX ZYNQ

Trenz Electronic GmbH

3,570 -
Bulk TE0745 RoHS - 1GB 32MB Obsolete Zynq-7000 (Z-7035) Samtec ST5 ARM® Cortex®-A9 2.05" x 2.99" (52mm x 76mm) MCU, FPGA -40°C ~ 85°C
TE0745-02-71I11-A

TE0745-02-71I11-A

SOM DDR3 1GB ZYNQ

Trenz Electronic GmbH

3,441 -
Bulk TE0745 RoHS - 1GB 64MB Obsolete Zynq-7000 (Z-7030) Samtec ST5 ARM® Cortex®-A9 2.05" x 2.99" (52mm x 76mm) MCU, FPGA -40°C ~ 85°C
TE0807-02-4BE21-A

TE0807-02-4BE21-A

IC MODULE ZYNQ USCALE

Trenz Electronic GmbH

3,206 -
Bulk RoHS - - - Obsolete - - - - - -
TE0807-02-04EG-1E

TE0807-02-04EG-1E

IC MODULE ZYNQ USCALE

Trenz Electronic GmbH

3,043 -
Bulk RoHS - - - Obsolete - - - - - -
TE0841-02-0401IL

TE0841-02-0401IL

IC MODULE

Trenz Electronic GmbH

2,161 -
Bulk TE0841 RoHS - 2GB 64MB Obsolete - B2B Kintex UltraScale KU40 1.97" x 1.57" (50mm x 40mm) MCU, FPGA -40°C ~ 85°C
TE0841-02-31I21-A

TE0841-02-31I21-A

IC MODULE

Trenz Electronic GmbH

2,685 -
TE0841-02-31I21-A

Datasheet

Bulk TE0841 RoHS - 2GB 64MB Active - B2B Kintex UltraScale KU035 1.97" x 1.57" (50mm x 40mm) FPGA Core -40°C ~ 85°C
TEC0850-03-15EG1EA

TEC0850-03-15EG1EA

IC MODULE

Trenz Electronic GmbH

2,090 -
Bulk TEC0850 RoHS - 8GB 128MB Obsolete - CompactPCI Serial Backplane Zynq UltraScale+ XCZU15EG-1FFVB1156E - MCU, FPGA -
TEC0850-03-BBEX1-C

TEC0850-03-BBEX1-C

IC MODULE

Trenz Electronic GmbH

3,484 -
Bulk RoHS - - - Active - - - - - -
TE0841-02-41I21-L

TE0841-02-41I21-L

IC MODULE

Trenz Electronic GmbH

3,848 -
TE0841-02-41I21-L

Datasheet

Bulk TE0841 RoHS - 2GB 64MB Active - B2B Kintex UltraScale KU040 1.97" x 1.57" (50mm x 40mm) FPGA Core -40°C ~ 85°C
Total 446 Record«Prev1234567...23Next»
HEIM

HEIM

PRODUKT

PRODUKT

TELEFON

TELEFON

BENUTZER

BENUTZER