Foto | Herst. Teil # | Verfügbarkeit | Preis | Menge | Datenblatt | Packaging | Series | ProductStatus | ProtoBoardType | PackageAccepted | NumberofPositions | Pitch | BoardThickness | Material |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DIP-ADAPTER-EVMMODULE EVAL DIP ADAPTER |
2,734 | - |
|
Box | - | Active | SMD to Plated Through Hole | MSOP, SC70, SOIC, SOT23, SOT563, TSSOP | 6 | - | - | - | ||
14-24-LOGIC-EVMDEVELOPMENT SPECIALIZED |
2,471 | - |
|
Box | - | Active | SMD to Plated Through Hole | SOIC, TSSOP | - | - | - | - | ||
EVM-LEADED1EVALUATION MODULE |
3,216 | - |
|
Datasheet |
Bulk | - | Active | SMD to DIP | - | - | - | - | - | |
EVM-LEADLESS1EVALUATION MODULE |
3,858 | - |
|
Datasheet |
Bulk | - | Active | SMD to DIP | - | - | - | - | - | |
SMALL-AMP-DIP-EVMBREAKOUT BOARD |
3,838 | - |
|
Datasheet |
Box | - | Active | SMD to DIP | DPW-5, DCN-8, DDF-8, DSG-8, RUG-10, RUC-14, RGY-14, RTE-16 | 16 | - | - | - | |
5-8-LOGIC-EVMLOGIC EVAL BOARD |
2,116 | - |
|
Datasheet |
Box | - | Active | SMD to Plated Through Hole | SC-70, SOT-23, SOT-583, SSOP, VSSOP | 8 | - | - | - | |
QFN16-DIP-EVMBREAKOUT BOARD |
3,704 | - |
|
Datasheet |
Box | - | Active | SMD to DIP | QFN | 16 | - | - | - |