Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-642-41-012101

116-83-642-41-012101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,868 -
116-83-642-41-012101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-2501-20

08-2501-20

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2,182 -
08-2501-20

Datenblatt

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-2501-30

08-2501-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3,304 -
08-2501-30

Datenblatt

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-2513-11H

10-2513-11H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,973 -
10-2513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-10T

26-3513-10T

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,955 -
26-3513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0503-21

05-0503-21

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3,856 -
05-0503-21

Datenblatt

Bulk 0503 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
05-0503-31

05-0503-31

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3,412 -
05-0503-31

Datenblatt

Bulk 0503 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
08-3518-01

08-3518-01

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,496 -
08-3518-01

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
ICA-318-ZSGT

ICA-318-ZSGT

CONN IC DIP SOCKET 18POS GOLD

Samtec Inc.

3,241 -
ICA-318-ZSGT

Datenblatt

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyester, Glass Filled
510-87-136-14-051101

510-87-136-14-051101

CONN SOCKET PGA 136POS GOLD

Preci-Dip

3,719 -
510-87-136-14-051101

Datenblatt

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-9513-10T

20-9513-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,870 -
20-9513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0513-11

17-0513-11

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3,193 -
17-0513-11

Datenblatt

Bulk 0513 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-4518-10H

20-4518-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,358 -
20-4518-10H

Datenblatt

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-80-037-10-061101

550-80-037-10-061101

PGA SOLDER TAIL

Preci-Dip

3,208 -
550-80-037-10-061101

Datenblatt

Bulk 550 Active PGA 37 (10 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-2401-N

XR2A-2401-N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div

3,966 -
XR2A-2401-N

Datenblatt

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
06-3518-10E

06-3518-10E

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,208 -
06-3518-10E

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3513-11

18-3513-11

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,142 -
18-3513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-950-41-001101

614-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3,085 -
614-83-950-41-001101

Datenblatt

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-664-41-005101

117-83-664-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

4,000 -
117-83-664-41-005101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-764-41-005101

117-83-764-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

2,743 -
117-83-764-41-005101

Datenblatt

Bulk 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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