Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
31-0518-10H

31-0518-10H

CONN SOCKET SIP 31POS GOLD

Aries Electronics

2,307 -
31-0518-10H

Datenblatt

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0518-10T

34-0518-10T

CONN SOCKET SIP 34POS GOLD

Aries Electronics

2,099 -
34-0518-10T

Datenblatt

Bulk 518 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-1518-10T

34-1518-10T

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3,571 -
34-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
37-0518-10

37-0518-10

CONN SOCKET SIP 37POS GOLD

Aries Electronics

3,559 -
37-0518-10

Datenblatt

Bulk 518 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0508-20

09-0508-20

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3,082 -
09-0508-20

Datenblatt

Bulk 508 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
09-0508-30

09-0508-30

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2,732 -
09-0508-30

Datenblatt

Bulk 508 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
116-83-324-41-004101

116-83-324-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,414 -
116-83-324-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-004101

116-83-424-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,875 -
116-83-424-41-004101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
828-AG12D-ES-LF

828-AG12D-ES-LF

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

2,368 -
828-AG12D-ES-LF

Datenblatt

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole, Right Angle, Vertical Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-144-12-000101

510-87-144-12-000101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

2,132 -
510-87-144-12-000101

Datenblatt

Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-144-13-001101

510-87-144-13-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

3,036 -
510-87-144-13-001101

Datenblatt

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-144-13-041101

510-87-144-13-041101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

2,782 -
510-87-144-13-041101

Datenblatt

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-6513-11H

12-6513-11H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,802 -
12-6513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-00

28-6518-00

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,663 -
28-6518-00

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0518-00

18-0518-00

CONN SOCKET SIP 18POS GOLD

Aries Electronics

3,912 -
18-0518-00

Datenblatt

Bulk 518 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-1518-00

18-1518-00

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,571 -
18-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0517-90C

10-0517-90C

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3,118 -
10-0517-90C

Datenblatt

Bulk 0517 Active SIP 10 (1 x 10) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-640-41-009101

116-87-640-41-009101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3,879 -
116-87-640-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-132-14-001101

510-87-132-14-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

2,040 -
510-87-132-14-001101

Datenblatt

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-145-13-041101

510-87-145-13-041101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

2,562 -
510-87-145-13-041101

Datenblatt

Bulk 510 Active PGA 145 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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