Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-328-41-011101

116-83-328-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,382 -
116-83-328-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3518-10H

20-3518-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,030 -
20-3518-10H

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-145-15-081101

510-87-145-15-081101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

3,008 -
510-87-145-15-081101

Datenblatt

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-145-17-001101

510-87-145-17-001101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

2,947 -
510-87-145-17-001101

Datenblatt

Bulk 510 Active PGA 145 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-624-SST

ICO-624-SST

CONN IC DIP SOCKET 24POS GOLD

Samtec Inc.

3,710 -
ICO-624-SST

Datenblatt

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
116-87-636-41-011101

116-87-636-41-011101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,711 -
116-87-636-41-011101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-002101

116-83-636-41-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,426 -
116-83-636-41-002101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-2811-N

XR2A-2811-N

CONN IC DIP SOCKET 28POS GOLD

Omron Electronics Inc-EMC Div

3,998 -
XR2A-2811-N

Datenblatt

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
08-3501-20

08-3501-20

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3,709 -
08-3501-20

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-3501-30

08-3501-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2,551 -
08-3501-30

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-11

25-0518-11

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3,629 -
25-0518-11

Datenblatt

Bulk 518 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-432-41-009101

116-83-432-41-009101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,492 -
116-83-432-41-009101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-001101

116-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,573 -
116-87-636-41-001101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-13-001101

510-83-085-13-001101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2,391 -
510-83-085-13-001101

Datenblatt

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-13-042101

510-83-085-13-042101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,234 -
510-83-085-13-042101

Datenblatt

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-13-081101

510-83-085-13-081101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2,998 -
510-83-085-13-081101

Datenblatt

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-448-41-105101

117-83-448-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,288 -
117-83-448-41-105101

Datenblatt

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-008101

116-87-642-41-008101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,445 -
116-87-642-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-6503-20

06-6503-20

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,363 -
06-6503-20

Datenblatt

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-6503-30

06-6503-30

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,479 -
06-6503-30

Datenblatt

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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