Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-085-10-031101

510-83-085-10-031101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2,028 -
510-83-085-10-031101

Datenblatt

Bulk 510 Active PGA 85 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-11-001101

510-83-085-11-001101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,062 -
510-83-085-11-001101

Datenblatt

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-11-041101

510-83-085-11-041101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,228 -
510-83-085-11-041101

Datenblatt

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-11-044101

510-83-085-11-044101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2,951 -
510-83-085-11-044101

Datenblatt

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-11-045101

510-83-085-11-045101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,071 -
510-83-085-11-045101

Datenblatt

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-075-11-001101

510-83-075-11-001101

CONN SOCKET PGA 75POS GOLD

Preci-Dip

2,501 -
510-83-075-11-001101

Datenblatt

Bulk 510 Active PGA 75 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-642-41-105101

117-83-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,295 -
117-83-642-41-105101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-3518-10M

16-3518-10M

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,970 -
16-3518-10M

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81000-10WR

14-81000-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,965 -
14-81000-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81100-10WR

14-81100-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,917 -
14-81100-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81187-10WR

14-81187-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,689 -
14-81187-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81250-10WR

14-81250-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,694 -
14-81250-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8260-10WR

14-8260-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,401 -
14-8260-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8350-10WR

14-8350-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,925 -
14-8350-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8400-10WR

14-8400-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,420 -
14-8400-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8435-10WR

14-8435-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,324 -
14-8435-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8470-10WR

14-8470-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,362 -
14-8470-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8510-10WR

14-8510-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,838 -
14-8510-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8620-10WR

14-8620-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,102 -
14-8620-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8770-10WR

14-8770-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,996 -
14-8770-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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